CROSSLINKABLE THERMOSET MONOMER, COMPOSITION FOR PRODUCING PRINTED CIRCUIT BOARD COMPRISING THE THERMOSET MONOMER AND PRINTED CIRCUIT BOARD USING THE COMPOSITION
申请人:CHO Chung Kun
公开号:US20090308643A1
公开(公告)日:2009-12-17
Disclosed herein is a crosslinkable thermoset monomer. The crosslinkable thermoset monomer has acetylene groups as crosslinking groups introduced at both ends of the backbone. Also disclosed herein is a composition for producing a printed circuit board which comprises the crosslinkable thermoset monomer. The composition exhibits excellent mechanical and thermal properties. Therefore, the composition can be used as a material for next-generation boards that are becoming lighter in weight and smaller in size and thickness. Also disclosed herein is a printed circuit board using the composition.