9,9-bis[3,5-dibromo-4-(2,3-epoxypropoxy)phenyl]fluorene | 114288-50-5

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 9,9-bis[3,5-dibromo-4-(2,3-epoxypropoxy)phenyl]fluorene
• 英文别名: 2-[[2,6-Dibromo-4-[9-[3,5-dibromo-4-(oxiran-2-ylmethoxy)phenyl]fluoren-9-yl]phenoxy]methyl]oxirane
• CAS: 114288-50-5
• 化学式: C₃₁H₂₂Br₄O₄
• 分子量: 778.129
• InChiKey: VZBFXRYOJIKXMH-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  8.8
• 重原子数：
  39
• 可旋转键数：
  8
• 环数：
  7.0
• sp3杂化的碳原子比例：
  0.23
• 拓扑面积：
  43.5
• 氢给体数：
  0
• 氢受体数：
  4

文献信息

• Glycidylethers of fluorene-containing bisphenols
  申请人：MINNESOTA MINING AND MANUFACTURING COMPANY

  公开号：EP0274209A1

  公开（公告）日：1988-07-13

  Diglycidyl ethers of ortho-substituted­4-hydroxyphenylfluorenes, curable compositions comprising the diglycidyl ethers, and cured resins thereof have a high glass transition and an improved modulus of elasticity. The diglycidyl ethers of the invention for use in the curable composition of the invention can be mixtures obtained by the reaction of epihalohydrin with mixtures of fluorenebisphenols obtained by the reaction of one mole of one or more fluorenones with two or more moles or mixtures of two or more ortho-substituted phenols. The compositions are useful in molding and coating applications and in composite articles where the operating temperature of the article or material is elevated.

  原代-4-羟基苯基芴的二缩水甘油醚、包含该二缩水甘油醚的可固化组合物及其固化树脂具有较高的玻璃化转变和更好的弹性模量。 用于本发明可固化组合物的本发明二缩水甘油醚可以是由表卤代烃与由一摩尔的一种或多种芴酮与两种或多种原代苯酚或两种或多种原代苯酚的混合物反应得到的芴双酚的混合物。 该组合物适用于模塑和涂层应用，以及物品或材料工作温度较高的复合物品。
• INSULATING SHEET AND LAMINATED STRUCTURE
  申请人：Sekisui Chemical Co., Ltd.

  公开号：EP2316897A1

  公开（公告）日：2011-05-04

  The present invention provides an insulating sheet which is excellent in handleability when it is uncured, prevents excessive flowage in laminating press, and provides a cured product excellent in dielectric breakdown characteristics, thermal conductivity, heat resistance, and processability. The insulating sheet used for bonding a heat conductor having a thermal conductivity of 10 W/m·K or higher to an electrically conductive layer, comprising: (A) a polymer having a weight average molecular weight of 10,000 or more; (B) at least one of an epoxy monomer (B1) having an aromatic skeleton and a weight average molecular weight of 600 or less and an oxetane monomer (B2) having an aromatic skeleton and a weight average molecular weight of 600 or less; (C) a curing agent; and (D) 20 to 60% by volume of a first inorganic filler; and (E) 1 to 40% by volume of at least one of an organic filler (E1), and a second inorganic filler (E2) that is different from the first inorganic filler (D) and has a new Mohs' hardness of 3 or less and, when the filler (E) contains the organic filler (E1), 3 to 40% by volume of the organic filler (E1).

  本发明提供了一种绝缘片材，它在未固化时具有极佳的可操作性，可防止在层压机中过度流动，并可提供具有极佳的介电击穿特性、导热性、耐热性和可加工性的固化产品。用于将导热系数为 10 W/m-K 或更高的热导体与导电层粘合的绝缘片材，包括(A) 具有 10,000 或以上重量平均分子量的聚合物；(B) 具有芳香族骨架且重量平均分子量为 600 或以下的环氧单体 (B1) 和具有芳香族骨架且重量平均分子量为 600 或以下的氧杂环丁烷单体 (B2) 中的至少一种；(C) 固化剂；(D) 20-60%（体积）的第一种无机填料；以及 (E) 1-40%（体积）的有机填料（E1）和第二种无机填料（E2）中的至少一种，第二种无机填料与第一种无机填料（D）不同，其新莫氏硬度为 3 或更低；当填料（E）包含有机填料（E1）时，有机填料（E1）的比例为 3-40%（体积）。
• Resin material and laminate
  申请人：SEKISUI CHEMICAL CO., LTD.

  公开号：US11168216B2

  公开（公告）日：2021-11-09

  Provided is a resin material capable of effectively improving the insulating properties and the thermal conductivity, and effectively controlling the variation in dielectric breakdown strength. A resin material according to the present invention includes first boron nitride aggregate particles, second boron nitride aggregate particles, and a binder resin, and a 10% K value of the second boron nitride aggregate particles is smaller than a 30% K value of the second boron nitride aggregate particles, and a 30% K value of the second boron nitride aggregate particles is smaller than a 10% K value of the first boron nitride aggregate particles.

  本发明提供了一种能够有效改善绝缘性能和热导率并有效控制介电击穿强度变化的树脂材料。根据本发明，一种树脂材料包括第一氮化硼骨料颗粒、第二氮化硼骨料颗粒和粘结剂树脂，第二氮化硼骨料颗粒的 10% K 值小于第二氮化硼骨料颗粒的 30% K 值，第二氮化硼骨料颗粒的 30% K 值小于第一氮化硼骨料颗粒的 10% K 值。
• THERMOSETTING MATERIAL AND CURED PRODUCT
  申请人：Sekisui Chemical Co., Ltd.

  公开号：EP3378899B1

  公开（公告）日：2021-09-29
• INSULATING SHEET AND MULTILAYER STRUCTURE
  申请人：Maenaka Hiroshi

  公开号：US20100297453A1

  公开（公告）日：2010-11-25

  The present invention provides an insulating sheet which is used for bonding a heat conductor having a thermal conductivity of 10 W/m·K or higher to an electrically conductive layer. The handleability of the insulating sheet is excellent when it is uncured, and a cured product of the insulating sheet has higher adhesion, heat resistance, dielectric breakdown characteristics, and thermal conductivity. The insulating sheet used for bonding a heat conductor having a thermal conductivity of 10 W/m·K or higher to an electrically conductive layer comprises: (A) a polymer having an aromatic skeleton and a weight average molecular weight of 10,000 or more; (B) at least one of an epoxy monomer (B1) having an aromatic skeleton and a weight average molecular weight of 600 or less and an oxetane monomer (B2) having an aromatic skeleton and a weight average molecular weight of 600 or less; (C) a curing agent composed of a phenol resin, an acid anhydride having an aromatic skeleton or an alicyclic skeleton, a hydrogenated product of the acid anhydride, or a modified product of the acid anhydride; and (D) a filler. When the insulating sheet is uncured, the insulating sheet has a glass transition temperature Tg of 25° C. or lower.