1,2-bis(propoxymethyl)benzene | 1271899-24-1

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 1,2-bis(propoxymethyl)benzene
• CAS: 1271899-24-1
• 化学式: C₁₄H₂₂O₂
• 分子量: 222.327
• InChiKey: LPBJKLRXCFYUNY-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3
• 重原子数：
  16
• 可旋转键数：
  8
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.57
• 拓扑面积：
  18.5
• 氢给体数：
  0
• 氢受体数：
  2

反应信息

• 作为产物：
  描述：

  丙醇 、 1,2-二(溴甲基)苯 在 iron(II) sulfate 作用下， 反应 12.0h， 以88%的产率得到1,2-bis(propoxymethyl)benzene
  参考文献：
  名称：

  FeSO4介导的苄基烷基醚合成新方法

  摘要：

  摘要 已经描述了在温和条件下不使用碱和助溶剂，使用 FeSO4 作为可回收和可重复使用的介质，从苄基溴和醇合成苄基烷基醚。

  DOI：

  10.1080/00397911003642674

文献信息

• Linear salicylic acid copolymers and their metal salts, production process thereof, color-developing agents comprising metal-resins of the copolymers, and color-developing sheets employing the agents
  申请人：MITSUI TOATSU CHEMICALS, Inc.

  公开号：EP0233450A2

  公开（公告）日：1987-08-26

  Disclosed herein are novel linear copolymers having weight average molecular weight of 500 - 30,000 and comprising structural units represented by the following formulae (I), (II), (III) and (IV): wherein R₁, R₂ and R₃ mean individually an alkyl group having 4 or fewer carbon atoms and R₄ denotes an alkyl, cycloalkyl, aralkyl or phenyl group, and multivalent metal salts thereof in each of which the multivalent metal forms the multivalent metal salt between carboxyl groups within the same molecule of the copolymer or between different molecules of the copolymer; color-­developing agents comprising multivalent metal-modified resins of the copolymers; and color-developing sheets obtained by coating the color-developing agents on their surfaces.

  本文公开了新型线性共聚物，其重量平均分子量为 500 - 30,000，包含下式 (I)、(II)、(III) 和 (IV) 所代表的结构单元： 其中 R₁、R₂ 和 R₃ 分别表示具有 4 个或更少碳原子的烷基，R₄ 表示烷基、环烷基、芳烷基或苯基，以及多价金属盐，其中多价金属在共聚物的同一分子内或共聚物的不同分子间的羧基之间形成多价金属盐；由共聚物的多价金属改性树脂组成的显色剂；以及通过在其表面涂布显色剂而获得的显色薄片。
• An epoxy-resin composition and use thereof
  申请人：MITSUI CHEMICALS, INC.

  公开号：EP0953588A2

  公开（公告）日：1999-11-03

  An epoxy-resin composition comprising (A) an at least bifunctional epoxy compound and/or an at least bifunctional epoxy resin, (B) a curing agent, and (C) an accelerating agent, the accelerating agent essentially containing a phosphine oxide represented by general formula (1);    where R1 to R6 all of which may be the same or not are hydrogen, straight, branched or cyclic alkyl having 1 to 10 carbons or aryl or aralkyl having 6 to 10 carbons. The epoxy-resin composition can be used for sealing a semiconductor integrated circuit in the manufacture of a semiconductor device.

  一种环氧树脂组合物，包括(A)至少双官能环氧化合物和/或至少双官能环氧树脂，(B)固化剂和(C)促进剂，促进剂基本上含有通式(1)所代表的氧化膦； 其中 R1 至 R6 可以相同或不相同，均为氢、具有 1 至 10 个碳原子的直链、支链或环 烷基或具有 6 至 10 个碳原子的芳基或芳烷基。环氧树脂组合物可用于在制造半导体器件时密封半导体集成电路。
• ADHESIVE COMPOSITION FOR OPTICAL WAVEGUIDE, ADHESIVE FILM FOR OPTICAL WAVEGUIDE AND ADHESIVE SHEET FOR OPTICAL WAVEGUIDE EACH USING THE SAME, AND OPTICAL DEVICE USING ANY OF THEM
  申请人：Hitachi Chemical Company, Ltd.

  公开号：EP2128213A1

  公开（公告）日：2009-12-02

  The present invention provides an adhesive composition for an optical waveguide which comprises (a) an epoxy resin, (b) a curing agent and (c) a high molecular compound, in which a total light transmittance and a light transmittance in a wavelength of 700 to 1600 nm in a cured matter of the adhesive composition are 80 % or more and in which a transparency is consistent with a heat resistance, an adhesive film for an optical waveguide prepared by forming the above adhesive composition into a film form, an adhesive sheet for an optical waveguide comprising the above adhesive composition and a supporting base material and an optical device produced by using them.

  本发明提供了一种光波导用粘合剂组合物，该组合物由(a)环氧树脂、(b)固化剂和(c)高分子化合物组成，在该粘合剂组合物的固化物中，总透光率和波长为700至1600纳米的透光率为80％或以上，并且透明度与耐热性一致、通过将上述粘合剂组合物制成薄膜而制备的光波导用粘合膜，由上述粘合剂组合物和支撑基材构成的光波导用粘合片，以及使用它们生产的光学器件。
• Adhesive composition , process for producing the same, adhesive film made with the same, substrate for semiconductor mounting, and semiconductor device
  申请人：——

  公开号：US20030069331A1

  公开（公告）日：2003-04-10

  The present invention provides an adhesive composition which comprises (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with said epoxy resin, and further optionally comprises (d) a filler and/or (e) a curing accelerator; a process for producing an adhesive composition, comprising: mixing (a) the epoxy resin and (b) the curing agent with (d) the filler, followed by mixing the resultant mixture with (c) the polymer compound incompatible with the epoxy resin; an adhesive film comprising the above-mentioned adhesive composition formed into a film; a substrate for mounting semiconductor comprising a wiring board and the above-mentioned adhesive film disposed thereon on its side where chips are to be mounted; and a semiconductor device which comprises the above-mentioned adhesive film or the substrate for mounting semiconductor.

  本发明提供了一种粘合剂组合物，它包括(a)环氧树脂，(b)固化剂和(c)与所述环氧树脂 不相容的聚合物化合物，还可选择包括(d)填料和/或(e)固化促进剂； 一种生产粘合剂组合物的工艺，包括：将(a) 环氧树脂和(b) 固化剂与(d) 填料混合，然后将所得混合物与(c) 与环氧树脂不相容的聚合物化合物混合； 由上述粘合剂组合物形成薄膜的粘合剂薄膜； 用于安装半导体的基板，该基板包括配线板和上述粘合剂薄膜，粘合剂薄膜铺设在配线板上安装芯片的一侧；以及 由上述粘合膜或半导体安装基板构成的半导体器件。
• Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device
  申请人：Inada Teiichi

  公开号：US20060100315A1

  公开（公告）日：2006-05-11

  The present invention provides an adhesive composition which comprises (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with said epoxy resin, and further optionally comprises (d) a filler and/or (e) a curing accelerator; a process for producing an adhesive composition, comprising: mixing (a) the epoxy resin and (b) the curing agent with (d) the filler, followed by mixing the resultant mixture with (c) the polymer compound incompatible with the epoxy resin; an adhesive film comprising the above-mentioned adhesive composition formed into a film; a substrate for mounting semiconductor comprising a wiring board and the above-mentioned adhesive film disposed thereon on its side where chips are to be mounted; and a semiconductor device which comprises the above-mentioned adhesive film or the substrate for mounting semiconductor.

  本发明提供了一种粘合剂组合物，该组合物包括(a)环氧树脂、(b)固化剂和(c)与所述环氧树脂不相容的聚合物化合物，还可选择包括(d)填料和/或(e)固化促进剂；一种生产粘合剂组合物的工艺，该工艺包括：将(a)环氧树脂和(b)固化剂与(d)填料混合，然后将所得混合物与(c)与环氧树脂不相容的高分子化合物混合；由上述粘合剂组合物制成薄膜的粘合剂薄膜；由布线板和上述粘合剂薄膜构成的半导体安装基板，该基板安装芯片的一侧；以及由上述粘合剂薄膜或半导体安装基板构成的半导体器件。