1,1'-Biadamantan-3,3'-di-carbonylchlorid | 36520-49-7

• 分子结构分类: 有机化合物 - 有机卤素化合物
• 英文名称: 1,1'-Biadamantan-3,3'-di-carbonylchlorid
• 英文别名: 1,1'-Biadamantane-3,3'-dicarbonyl chloride；3-(3-carbonochloridoyl-1-adamantyl)adamantane-1-carbonyl chloride
• CAS: 36520-49-7
• 化学式: C₂₂H₂₈Cl₂O₂
• 分子量: 395.369
• InChiKey: SAPPGHSZNBANPK-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  6.2
• 重原子数：
  26
• 可旋转键数：
  3
• 环数：
  8.0
• sp3杂化的碳原子比例：
  0.91
• 拓扑面积：
  34.1
• 氢给体数：
  0
• 氢受体数：
  2

文献信息

• Benzoxazole Resin Precursor, Polybenzoxazole Resin, Resin Film And Semiconductor Device
  申请人：Enoki Takashi

  公开号：US20080206548A1

  公开（公告）日：2008-08-28

  A benzoxazole resin precursor comprising a first repeating unit which is obtained by the reaction of a bisaminophenol compound and a dicarboxylic acid compound, at least one of which has the diamondoid structure; a benzoxazole resin precursor further comprising a second repeating unit which is obtained by the reaction of a bisaminophenol compound having no diamondoid structure and a dicarboxylic acid compound having no diamondoid structure; a polybenzoxazole resin obtained by the ring-closing reaction with dehydration of the above benzoxazole resin precursor; a resin film constituted with the benzoxazole resin precursor or the polybenzoxazole resin. A polybenzoxazole resin and a resin film having excellent heat resistance and a small permittivity and a semiconductor device using the resin film can be obtained from the benzoxazole resin precursor.

  一种苯并噁唑树脂前体，包括第一重复单元，该单元由双氨基酚化合物和二羧酸化合物反应得到，其中至少一个具有金刚烷结构；一种苯并噁唑树脂前体，进一步包括第二重复单元，该单元由不具有金刚烷结构的双氨基酚化合物和不具有金刚烷结构的二羧酸化合物反应得到；通过上述苯并噁唑树脂前体的环合反应和脱水反应得到的聚苯并噁唑树脂；由苯并噁唑树脂前体或聚苯并噁唑树脂构成的树脂膜。可以从苯并噁唑树脂前体中获得具有优异耐热性和小介电常数的聚苯并噁唑树脂和树脂膜，以及使用树脂膜的半导体器件。
• BENZOXAZOLE RESIN PRECURSOR, POLYBENZOXAZOLE RESIN, RESIN FILM, AND SEMICONDUCTOR DEVICE
  申请人：Sumitomo Bakelite Company, Limited

  公开号：EP1832619A1

  公开（公告）日：2007-09-12

  A benzoxazole resin precursor comprising a first repeating unit which is obtained by the reaction of a bisaminophenol compound and a dicarboxylic acid compound, at least one of which has the diamondoid structure; a benzoxazole resin precursor further comprising a second repeating unit which is obtained by the reaction of a bisaminophenol compound having no diamondoid structure and a dicarboxylic acid compound having no diamondoid structure; a polybenzoxazole resin obtained by the ring-closing reaction with dehydration of the above benzoxazole resin precursor; a resin film constituted with the benzoxazole resin precursor or the polybenzoxazole resin. A polybenzoxazole resin and a resin film having excellent heat resistance and a small permittivity and a semiconductor device using the resin film can be obtained from the benzoxazole resin precursor.

  一种苯并恶唑树脂前体，包括由双氨基苯酚化合物和二羧酸化合物反应得到的 第一重复单元，其中至少一个重复单元具有菱形结构；苯并恶唑树脂前体，进一步包含第二重复单元，该第二重复单元由无菱形结构的双氨基苯酚化合物和无菱形结构的二羧酸化合物反应得到； 通过上述苯并恶唑树脂前体的脱水闭环反应得到的聚苯并恶唑树脂； 由苯并恶唑树脂前体或聚苯并恶唑树脂构成的树脂薄膜。利用苯并恶唑树脂前体可获得具有优异耐热性和较小介电常数的聚苯并恶唑树脂和树脂薄膜，以及使用该树脂薄膜的半导体器件。
• US8337982B2
  申请人：——

  公开号：US8337982B2

  公开（公告）日：2012-12-25