This invention relates to a photo- or heat-curable resin composition which yields a cured product with minimal cracking and high reliability. The resin composition of this invention comprises 100 parts by weight of (A) photo- or heat-polymerizable unsaturated compound composed of a polycarboxylic acid adduct of bisphenol-epoxy (meth)acrylate , 10-100 parts by weight of (B) alkylene oxide-modified product of (meth)acrylate or oligomers thereof, 0-50 parts by weight of (C) compound containing epoxy group and 0-50 parts by weight of (D) photopolymerization initiator or sensitizer. The composition exhibits high heat resistance and good microfabrication quality and is useful as a peripheral material of electronic parts such as semiconductor devices by the build-up process, for example, as a material for forming insulation layers in multilayer printed wiring boards.
本发明涉及一种光固化或热固化
树脂组合物,其固化产品裂纹极少,可靠性高。本发明的
树脂组合物包括 100 重量份的(A)由双
酚-环氧(甲基)
丙烯酸酯的聚
羧酸加合物组成的可光聚合或热聚合的不饱和化合物、10-100 重量份的(B)(甲基)
丙烯酸酯的环氧烷改性产物或其低聚物、0-50 重量份的(C)含环氧基的化合物和 0-50 重量份的(D)光聚合
引发剂或敏化剂。该组合物具有高耐热性和良好的微细加工质量,可通过堆积工艺用作半导体器件等电子零件的外围材料,例如用作多层印刷线路板中形成绝缘层的材料。