3a,4,4a,7a,8,8a-hexahydro-2,6-bis(p-methylphenylsulfonyloxy)-4,8-ethenobenzo[1,2-c:4,5-c']dipyrrole-1,3,5,7(2H,6H)-tetrone | 535952-31-9

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 3a,4,4a,7a,8,8a-hexahydro-2,6-bis(p-methylphenylsulfonyloxy)-4,8-ethenobenzo[1,2-c:4,5-c']dipyrrole-1,3,5,7(2H,6H)-tetrone
• 英文别名: [10-(4-Methylphenyl)sulfonyloxy-3,5,9,11-tetraoxo-4,10-diazatetracyclo[5.5.2.02,6.08,12]tetradec-13-en-4-yl] 4-methylbenzenesulfonate
• CAS: 535952-31-9
• 化学式: C₂₆H₂₂N₂O₁₀S₂
• 分子量: 586.6
• InChiKey: VWSRMTPVUFZPOY-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1.8
• 重原子数：
  40
• 可旋转键数：
  6
• 环数：
  7.0
• sp3杂化的碳原子比例：
  0.31
• 拓扑面积：
  178
• 氢给体数：
  0
• 氢受体数：
  10

文献信息

• BISIMIDE COMPOUND, ACID GENERATOR AND RESIST COMPOSITION EACH CONTAINING THE SAME, AND METHOD OF FORMING PATTERN FROM THE COMPOSITION
  申请人：Wako Pure Chemical Industries, Ltd.

  公开号：EP1449833A1

  公开（公告）日：2004-08-25

  The present invention relates to a novel bisimide compound useful as an acid generator for a chemically amplified resist composition used in manufacturing of semiconductor element and the like or a raw material for synthesizing heat resistant polymers, an acid generator and a resist composition using said compound and a method for pattern formation using said composition, and further relates to a synthetic n intermediate for a bisimide compound and a bis(N-hydroxy)phthalimide compound useful as an intermediate for a functional compound such as a heat resistant polymer or photosensitive material, and provides a bisimide compound shown by the general formula [1]: (wherein R and A1 are as defined in claim 1.)

  本发明涉及一种新型双酰亚胺化合物，可用作用于制造半导体元件等的化学放大抗蚀剂组合物的酸发生器或合成耐热聚合物的原料，还涉及使用所述化合物的酸发生器和抗蚀剂组合物以及使用所述组合物的图案形成方法、并进一步涉及一种双亚胺化合物的合成 n 中间体和一种双（N-羟基）邻苯二甲酰亚胺化合物，可用作耐热聚合物或感光材料等功能化合物的中间体，并提供了通式[1]所示的双亚胺化合物： (其中 R 和 A1 如权利要求 1 所定义）。
• Bismide compound, acid generator and resist composition each containing the same, and method of forming pattern from the composition
  申请人：Maesawa Tsuneaki

  公开号：US20050038261A1

  公开（公告）日：2005-02-17

  The present invention relates to a novel bisimide compound useful as an acid generator for a chemically amplified resist composition used in manufacturing of semiconductor element and the like or a raw material for synthesizing heat resistant polymers, an acid generator and a resist composition using said compound and a method for pattern formation using said composition, and further relates to a synthetic n intermediate for a bisimide compound and a bis(N-hydroxy)phthalimide compound useful as an intermediate for a functional compound such as a heat resistant polymer or photosensitive material, and provides a bisimide compound shown by the general formula [1]: (wherein R and A 1 are as defined in claim 1. )

  本发明涉及一种新型双酰亚胺化合物，可用作用于制造半导体元件等的化学放大抗蚀剂组合物的酸发生器或合成耐热聚合物的原料，还涉及使用所述化合物的酸发生器和抗蚀剂组合物以及使用所述组合物的图案形成方法、并进一步涉及一种双亚胺化合物的合成 n 中间体和一种双（N-羟基）邻苯二甲酰亚胺化合物，可用作耐热聚合物或感光材料等功能化合物的中间体，并提供了通式[1]所示的双亚胺化合物： (其中 R 和 A 1 如权利要求 1. )
• HALOGEN-FREE SULPHONIC ACID ESTER AND/OR SULPHINIC ACID ESTER AS FLAME RETARDANT, FLAME RETARDANT SYNERGISTS AND RADICAL GENERATORS IN PLASTICS
  申请人：FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E. V.

  公开号：US20200231783A1

  公开（公告）日：2020-07-23

  The present invention relates to the use of halogen-free sulphonic acid esters and/or sulphinic acid esters as flame retardant and/or flame retardant synergists in plastics. The invention furthermore relates to the use of said compounds as radical generators in plastics, particularly in order to increase the molecular weight of the plastics, to branch and/or cross-link the plastics, to reduce the molecular weight of the plastics, to influence the molecular weight distribution of the plastics and to graft unsaturated monomers to the plastics. The present invention furthermore relates to the use of flame-retardant plastic compositions in the electrical or electronics industry, construction industry, transport industry, preferably automobiles, aircraft, trains and ships, for medical applications, for household appliances, vehicle parts, consumer products, packaging, furniture and textiles.
• US7374857B2
  申请人：——

  公开号：US7374857B2

  公开（公告）日：2008-05-20