3-[(3-Amino-2-ethoxyphenyl)methyl]-2-ethoxyaniline | 2506-43-6

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 3-[(3-Amino-2-ethoxyphenyl)methyl]-2-ethoxyaniline
• CAS: 2506-43-6
• 化学式: C₁₇H₂₂N₂O₂
• 分子量: 286.374
• InChiKey: NFTZAIWLELRZEN-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.2
• 重原子数：
  21
• 可旋转键数：
  6
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.29
• 拓扑面积：
  70.5
• 氢给体数：
  2
• 氢受体数：
  4

文献信息

• Thermosetting resin composition, resin film for interlayer insulation, composite film, printed wiring board, and method for producing same
  申请人：Hitachi Chemical Company, LTD.

  公开号：US10544305B2

  公开（公告）日：2020-01-28

  Provided is a thermosetting resin composition containing a polyimide compound (A) having a structural unit derived from a maleimide compound (a1) having at least two N-substituted maleimide groups and a structural unit derived from a diamine compound (a2); a modified polybutadiene (B); and an inorganic filler (C).

  本文提供了一种热固性树脂组合物，其中包含聚酰亚胺化合物（A），其结构单元来源于马来酰亚胺化合物（a1），马来酰亚胺化合物（a1）至少有两个 N-取代马来酰亚胺基团，结构单元来源于二胺化合物（a2）；改性聚丁二烯（B）；以及无机填料（C）。
• PRIMER LAYER FOR PLATING PROCESS, LAMINATE FOR CIRCUIT BOARD AND PRODUCTION METHOD FOR SAME, AND MULTILAYER CIRCUIT BOARD AND PRODUCTION METHOD FOR SAME
  申请人：Hitachi Chemical Co., Ltd.

  公开号：EP2716793B1

  公开（公告）日：2019-04-10
• PRIMER LAYER FOR PLATING PROCESS, LAMINATE FOR WIRING BOARD AND METHOD FOR MANUFACTURE THEREOF, MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURE THEREOF
  申请人：FUJIMOTO Daisuke

  公开号：US20120305291A1

  公开（公告）日：2012-12-06

  Disclosed are a primer layer for plating process exhibiting high adhesiveness to an electroless copper plating and capable of coping with high density of wirings of semiconductor packages; a laminate for wiring board having the primer layer and a method for manufacture thereof; and a multilayer wiring board having the primer layer and a method for manufacture thereof. The primer layer is formed of a resin composition including (A) a polyfunctional epoxy resin, (B) an epoxy resin curing agent, and (C) a phenolic hydroxyl group-containing polybutadiene-modified polyamide resin having specified structural units, wherein a blending proportion of the component (C) is 5 parts by mass or more and less than 25 parts by mass based on 100 parts by mass of a total sum of the component (A) and the component (B).
• THERMOSETTING RESIN COMPOSITION, RESIN FILM FOR INTERLAYER INSULATION, COMPOSITE FILM, PRINTED WIRING BOARD, AND METHOD FOR PRODUCING SAME
  申请人：Hitachi Chemical Company, LTD.

  公开号：US20180327593A1

  公开（公告）日：2018-11-15

  Provided is a thermosetting resin composition containing a polyimide compound (A) having a structural unit derived from a maleimide compound (a1) having at least two N-substituted maleimide groups and a structural unit derived from a diamine compound (a2); a modified polybutadiene (B); and an inorganic filler (C).
• THERMOSETTING RESIN COMPOSITION, INTERLAYER INSULATION RESIN FILM, COMPOSITE FILM, PRINTED WIRING BOARD, AND PRODUCTION METHOD THEREOF
  申请人：HITACHI CHEMICAL COMPANY, LTD.

  公开号：US20190284395A1

  公开（公告）日：2019-09-19

  The present invention relates to a thermosetting resin composition containing an inorganic filler (A 1 ) containing a nanofiller (a), a thermosetting resin (B), and an elastomer (C); and a thermosetting resin composition containing an inorganic filler (A 2 ), a thermosetting resin (B), and an elastomer (C), wherein the inorganic filler (A 2 ) has at least two peaks of a first peak and a second peak in a particle size distribution measured according to the laser diffraction scattering method, and a peak position of the first peak appears at 0.3 to 0.7 μm, while a peak position of the second peak appears at 0.7 to 1.2 μm.