2,2'-Bis-(trifluormethyl)-4,4'-diisocyanato-biphenyl | 37957-24-7

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 2,2'-Bis-(trifluormethyl)-4,4'-diisocyanato-biphenyl
• 英文别名: 2,2'-bis(trifluoromethyl)-4,4'-diisocyanatobiphenyl；1,1'-Biphenyl, 4,4'-diisocyanato-2,2'-bis(trifluoromethyl)-；4-isocyanato-1-[4-isocyanato-2-(trifluoromethyl)phenyl]-2-(trifluoromethyl)benzene
• CAS: 37957-24-7
• 化学式: C₁₆H₆F₆N₂O₂
• 分子量: 372.226
• InChiKey: GAQVRYAUXJRQSE-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  6.9
• 重原子数：
  26
• 可旋转键数：
  3
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.12
• 拓扑面积：
  58.9
• 氢给体数：
  0
• 氢受体数：
  10

文献信息

• Thermosetting resin composition and cured product of the same
  申请人：DIC Corporation

  公开号：EP2540759A2

  公开（公告）日：2013-01-02

  A thermosetting resin composition comprising a polyimide resin (A) and a boron compound (B) represented by general formula (b3) below, wherein the polyimide resin (A) is a polyimide resin having a divalent structural unit represented by general formula (a1) below in the formula (b3), R3's each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or an alkoxy group having 1 to 4 carbon atoms; and Z represents a nitrogen-containing heterocyclic compound.

  一种热固性树脂组合物，由聚酰亚胺树脂 (A) 和硼化合物 (B) 组成，如下文通式 (b3) 所示，其中聚酰亚胺树脂 (A) 是具有如下文通式 (a1) 所示二价结构单元的聚酰亚胺树脂 在式 (b3) 中，R3 各自独立地代表氢原子、具有 1 至 4 个碳原子的烷基或具有 1 至 4 个碳原子的烷氧基；以及 Z 代表含氮杂环化合物。
• THERMOSETTING RESIN COMPOSITION, CURED PRODUCT THEREOF, AND INTERLAYER ADHESIVE FILM FOR PRINTED WIRING BOARD
  申请人：DIC Corporation

  公开号：EP2671920A1

  公开（公告）日：2013-12-11

  There is provided a thermosetting polyimide resin composition which enables production of a cured product exhibiting excellent dimensional stability and which exhibits excellent meltability at low temperature in a semicured state (in the B-stage) and excellent flame resistance in a completely cured state; there are also provided a cured product of such a composition and an interlaminar adhesive film used for a printed wiring board, the interlaminar adhesive film being formed of the composition. In particular, there are provided a thermosetting polyimide resin composition containing a thermosetting polyimide resin (A) having a biphenyl backbone directly linked to a nitrogen atom of a five-membered cyclic imide backbone and a weight-average molecular weight (Mw) of 3,000 to 150,000, a phosphorus compound (B) represented by specific Formula (bl) or (b2), and an epoxy resin (C); a cured product of such a composition; and an interlaminar adhesive film used for a printed wiring board, the interlaminar adhesive film including a layer formed of the composition, the layer being formed on a carrier film.

  本发明提供了一种热固性聚酰亚胺树脂组合物，该组合物能够生产出具有优异尺寸稳定性的固化产品，并且在半固化状态（B 阶段）下具有优异的低温熔融性，在完全固化状态下具有优异的阻燃性；本发明还提供了这种组合物的固化产品和用于印刷线路板的层间粘合膜，层间粘合膜由该组合物形成。特别是提供了一种热固性聚酰亚胺树脂组合物，该组合物含有热固性聚酰亚胺树脂（A）（其联苯骨架与五元环状亚胺骨架的氮原子直接相连，且重量平均分子量（Mw）在 3,000 至 150,000 之间）、磷化合物（B）（由具体式（bl）或（b2）表示）和环氧树脂（C）；这种组合物的固化产品；以及用于印刷线路板的层间粘合膜，层间粘合膜包括由该组合物形成的层，该层形成在载体薄膜上。
• POLYAMIDE-IMIDE, METHOD FOR PREPARING SAME, AND POLYAMIDE-IMIDE FILM USING SAME
  申请人：LG Chem, Ltd.

  公开号：EP3363845A1

  公开（公告）日：2018-08-22

  The present invention provides a polyamide-imide, a method for preparing same, and a polyimide film using same. The polyamide-imide film exhibits excellent transparency, heat resistance, mechanical strength and flexibility, and thus may be used in various fields such as substrates for device, cover substrates for displays, optical films, integrated circuit (IC) packages, adhesive films, multi-layer flexible printed circuits (FPCs), tapes, touch panels and protective films for optical discs.

  本发明提供了一种聚酰胺-酰亚胺、一种制备方法以及一种使用聚酰胺-酰亚胺的聚酰亚胺薄膜。这种聚酰胺-酰亚胺薄膜具有优异的透明度、耐热性、机械强度和柔韧性，因此可用于各种领域，如设备基板、显示器覆盖基板、光学薄膜、集成电路（IC）封装、粘合薄膜、多层柔性印刷电路（FPC）、胶带、触摸屏和光盘保护膜。
• Aromatic polycarbodiimide and films thereof
  申请人：NITTO DENKO CORPORATION

  公开号：EP0792897B1

  公开（公告）日：2003-08-13
• THERMOSETTING RESIN COMPOSITE AND CURED PRODUCT THEREOF
  申请人：DIC Corporation

  公开号：EP2436734B1

  公开（公告）日：2014-07-23