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3,3'-bis(p-aminophenoxy)diphenyl sulfide | 118570-30-2

中文名称
——
中文别名
——
英文名称
3,3'-bis(p-aminophenoxy)diphenyl sulfide
英文别名
4-[3-[3-(4-Aminophenoxy)phenyl]sulfanylphenoxy]aniline
3,3'-bis(p-aminophenoxy)diphenyl sulfide化学式
CAS
118570-30-2
化学式
C24H20N2O2S
mdl
——
分子量
400.501
InChiKey
LEUQLXVKRVZUEX-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    5.7
  • 重原子数:
    29
  • 可旋转键数:
    6
  • 环数:
    4.0
  • sp3杂化的碳原子比例:
    0.0
  • 拓扑面积:
    95.8
  • 氢给体数:
    2
  • 氢受体数:
    5

文献信息

  • TERMINALLY MODIFIED POLYBRANCHED POLYIMIDE, METAL-PLATED TERMINALLY MODIFIED POLYBRANCHED POLYIMIDE, AND METHOD FOR PRODUCING THE SAME
    申请人:Ataka Kikuo
    公开号:US20100009206A1
    公开(公告)日:2010-01-14
    A terminally-modified polybranched polyimide which can be efficiently complexed with an inorganic material is obtained by reacting a component (a): tetracarboxylic dianhydride; a component (b): as an amine component, a mixture of a triamine and a diamine (which may be composed of a triamine only); and a component (c): as a terminal component, a compound selected from general formulae (1-1) to (1-4). H 2 N—X—R 1 (1-1) (In the formula, X represents a single bond or an alkylene group having 1 to 3 carbon atoms, and R 1 represents a nitrogen-containing heterocyclic group). H 2 N—X—R 1 (1-2) (In the formula, X is as defined above, and R 1 represents a sulfur-containing heterocyclic group or an aryl group having a thiol or thioether group in the molecule). (In the formula, R represents a nitrogen-containing heterocyclic group). (In the formula, R represents a monovalent residue).
    通过反应组分(a):四羧酸二酐;组分(b):作为胺组分,三胺和二胺的混合物(可以仅由三胺组成);以及组分(c):作为末端组分,从通式(1-1)到(1-4)中选择的化合物,可以获得与无机材料高效络合的终止修饰的多支化聚酰亚胺H2N-X-R1(1-1)(式中,X表示单键或具有1到3个碳原子的烷基基团,R1表示含氮杂环基团)。 -X-R1(1-2)(式中,X如上定义,R1表示含杂环基团或分子中具有巯基或醚基团的芳基基团)。 (式中,R表示含氮杂环基团)。 (式中,R表示单价残基)。
  • Polyimide composition
    申请人:MITSUI TOATSU CHEMICALS, Inc.
    公开号:EP0564299A2
    公开(公告)日:1993-10-06
    This invention relates to a thermoplastic resin composition having good processability, comprising 99.9 ∼ 50 parts by weight of one or more thermoplastic resin and 0.1 ∼ 50 parts by weight of one or more liquid crystal type aromatic polyimide. The thermoplastic resin composition comprise 99.9 ∼ 50 parts by weight of one or more thermoplastic resin selected from the group consisting of aromatic polyimide, aromatic polyetherimide, aromatic polyamideimide, aromatic polyethersulfone and aromatic polyether ketone and 0.1 ∼ 50 parts by weight of one or more liquid crystal type aromatic polyimide having recurring structural units represented by the formula (1) : wherein R₁ ∼ R₅ is a hydrogen atom, fluorine atom, trifluoromethyl, methyl, ethyl or cyano and may be the same or different, and R is a tetravalent radical having 6 ∼ 27 carbon atoms and being selected from the group consisting of a monoaromatic radical, condensed polyaromatic radical and noncondensed aromatic radical connected each other with a direct bond or a bridge member. The present invention can provide thermoplastic resin compositions which have remarkably good processability and excellent thermal stability in addition to essentially excellent properties of each resin.
    本发明涉及一种具有良好加工性的热塑性树脂组合物,按重量计,由 99.9 ∼ 50 份一种或多种热塑性树脂和 0.1 ∼ 50 份一种或多种液晶型芳香族聚酰亚胺组成。 热塑性树脂组合物包括 99.9 ∼ 50 重量份的一种或多种热塑性树脂(选自芳香族聚酰亚胺、芳香族聚醚酰亚胺、芳香族聚酰胺酰亚胺、芳香族聚醚砜和芳香族聚醚酮组成的组)和 0.1 ∼ 50 重量份的一种或多种液晶型芳香族聚酰亚胺(具有由式(1)表示的重复结构单元): 其中,R₁ ∼ R₅是氢原子、原子、三甲基、甲基、乙基或基,可以相同或不同;R 是具有 6 ∼ 27 个碳原子的四价基,选自由单芳香族基、缩合多芳香族基和非缩合芳香族基组成的组,这些芳香族基通过直接键或桥件相互连接。 本发明可提供热塑性树脂组合物,这些组合物除了具有各种树脂的基本优良特性外,还具有显著的加工性能和优良的热稳定性。
  • Polyimide, and preparation process of same
    申请人:MITSUI TOATSU CHEMICALS, Inc.
    公开号:EP0572196A1
    公开(公告)日:1993-12-01
    This invention relates to a novel thermoplastic and amorphous polyimide which is readily soluble in organic solvent, a novel aromatic diamino compound used for the polyimide, and a preparation process thereof. The polyimide comprise a requisite structural unit having one or more recurring structural units of the formula: wherein m and n are individually an integer of 0 or 1, and R is The polyimide of the invention is essentially amorphous, excellent in melt flow stability in the decreased temperature as compared with conventionally known polyimide and has greatly improved processability. The polyimide of the invention obtained by using a novel aromatic diamino compound as a monomer can control various properties such as melt flow ability and solubility in solvents by side chains and not by principal chain of polyimide. Thus, excellent melt flow property and solubility in solvents can be obtained while maintaining high heat resistance and adhesive property which are derived from benzophenone structure of the diamino compound of the the invention.
    本发明涉及一种易溶于有机溶剂的新型热塑性无定形聚酰亚胺、一种用于聚酰亚胺的新型芳香族二氨基化合物及其制备工艺。 该聚酰亚胺包括一个必要的结构单元,该结构单元具有一个或多个式中的重复结构单元: 其中 m 和 n 分别是 0 或 1 的整数,R 是 本发明的聚酰亚胺基本上是无定形的,与传统已知的聚酰亚胺相比,在温度降低时熔体流动稳定性极佳,而且加工性能大大提高。 使用新型芳香族二氨基化合物作为单体得到的本发明聚酰亚胺可以通过侧链而不是聚酰亚胺的主链来控制熔体流动能力和在溶剂中的溶解度等各种性能。因此,在保持本发明二氨基化合物二苯甲酮结构所产生的高耐热性和粘合性的同时,还能获得优异的熔体流动性能和在溶剂中的溶解性。
  • Insulating adhesive tape, and lead frame and semiconductor device employing the tape
    申请人:MITSUI TOATSU CHEMICALS, Inc.
    公开号:EP0605112A2
    公开(公告)日:1994-07-06
    An insulating adhesive tape comprises a base supporting film and an adhesive layer formed on at least one surface thereof, said adhesive layer being formed of a thermoplastic polymer comprising a thermoplastic polyimide. The thermoplastic polymer has a glass transition temperature ranging from 180°C to 280°C and an elastic modulus ranging from 10¹⁰ dyne/cm² to 10¹¹ dyne/cm² at 25°C, said modulus including a value ranging from 10² dyne/cm² to 10⁹ dyne/cm² at a temperature between 250°C and 300°C.
    绝缘胶粘带包括基底支撑膜和至少在其一个表面形成的粘合层,所述粘合层由热塑性聚合物形成,包括热塑性聚酰亚胺。热塑性聚合物的玻璃化温度为 180°C 至 280°C,25°C 时的弹性模量为 10¹⁰ dyne/cm² 至 10¹¹ dyne/cm²,250°C 至 300°C时的弹性模量为 10² dyne/cm² 至 10⁹ dyne/cm²。
  • THERMOPLASTIC RESIN COMPOSITION AND PROCESS FOR MOLDING THE SAME
    申请人:NEW JAPAN CHEMICAL CO.,LTD.
    公开号:EP0657497A1
    公开(公告)日:1995-06-14
    A thermoplastic resin composition comprising 100 parts by weight of a thermoplastic resin and 0.1-100 parts by weight of an imide compound prepared by, for example, condensation of 1,2,3,4-butanetetracarboxylic acid or a mono- or dianhydride thereof with a primary amine; and a process for molding the composition.
    一种热塑性树脂组合物,包括 100 重量份的热塑性树脂和 0.1-100 重量份的亚胺化合物,亚胺化合物是由 1,2,3,4-丁烷四羧酸或其单酸酐或二酸酐与伯胺缩合而成;以及一种成型该组合物的工艺。
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