4.4'-Diamino-3.5.3'.5'-tetramethyl-benzophenon | 96211-28-8

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 4.4'-Diamino-3.5.3'.5'-tetramethyl-benzophenon
• 英文别名: 4,4'-Diamino-2,2',5,5'-tetramethylbenzophenon；Bis(4-amino-3,5-dimethylphenyl)methanone
• CAS: 96211-28-8
• 化学式: C₁₇H₂₀N₂O
• 分子量: 268.359
• InChiKey: ALNVUIRNXPXOQI-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.4
• 重原子数：
  20
• 可旋转键数：
  2
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.24
• 拓扑面积：
  69.1
• 氢给体数：
  2
• 氢受体数：
  3

文献信息

• Polyimides, thermosetting resin compositions containing the polyimides, formed articles of the resin compositions, and production process of the polyimides
  申请人：HITACHI CHEMICAL CO., LTD.

  公开号：EP0553612A2

  公开（公告）日：1993-08-04

  A polyimide comprises structural units represented by the following formula: wherein Ar is a group consisting of 10-90 mole % of a first specific structural sub-unit and 90-10 mole % of a second particular structural sub-unit. A process for the production of the polyimide and a thermosetting resin composition comprising the polyimide and a particular polymaleimide are also disclosed.

  聚酰亚胺包括下式所代表的结构单元： 其中 Ar 是由 10-90 摩尔%的第一种特定结构亚单元和 90-10 摩尔%的第二种特定结构亚单元组成的组。本发明还公开了聚酰亚胺的生产工艺以及包含聚酰亚胺和特定聚马来酰亚胺的热固性树脂组合物。
• Optical element, method for the production thereof and optical module
  申请人：Hitachi Chemical Co., Ltd.

  公开号：US20030054184A1

  公开（公告）日：2003-03-20

  The invention provides an optical element comprising a substrate having provided thereon a coating of an organic zirconium compound, a coating of a fluorine-free polyimide resin and a coating of a fluorine-containing polyimide resin, in this order. The element has increased adhesive property with the substrate and reliability.

  本发明提供了一种光学元件，它由基板组成，基板上依次涂有有机锆化合物涂层、无氟聚酰亚胺树脂涂层和含氟聚酰亚胺树脂涂层。该元件与基板的粘合性和可靠性均有所提高。
• Adhesive film for semiconductor, lead frame and semiconductor device using the same
  申请人：——

  公开号：US20030102573A1

  公开（公告）日：2003-06-05

  An adhesive film for semiconductor comprises a support film, and adhesive layers formed on both surfaces of the support film, in which each adhesive layer comprises an adhesive having a glass transition temperature of 200° C. or less, a coefficient of linear expansion of 70 ppm or less, and a storage elastic modulus of 3 GPa or less, and the adhesive film has a total thickness of between 43 and 57 &mgr;m. A lead frame for semiconductor comprises a lead frame and an adhesive film for semiconductor according to the present invention. A semiconductor device comprises a lead frame and a semiconductor element, in which the lead frame and the semiconductor element are adhered to each other via an adhesive film for semiconductor according to the present invention.

  一种半导体用粘合膜包括支撑膜和形成在支撑膜两个表面上的粘合层，其中每个粘合层包括玻璃化转变温度为200℃或更低、线膨胀系数为70ppm或更低、存储弹性模量为3GPa或更低的粘合剂，粘合膜的总厚度在43至57&mgr;m之间。根据本发明，半导体引线框架包括引线框架和半导体粘合膜。半导体器件包括引线框架和半导体元件，其中引线框架和半导体元件通过本发明的半导体用粘合剂薄膜相互粘合。
• EP0141781B1
  申请人：——

  公开号：EP0141781B1

  公开（公告）日：1991-09-04
• Photostrukturierbare Polyimidmischungen, Polyimide auf Basis von Benzhydroltetracarbonsäure und deren Herstellung
  申请人：CIBA-GEIGY AG

  公开号：EP0274354B1

  公开（公告）日：1992-01-08