2-Chlor-4'-hydroxy-diphenylsulfon | 20804-16-4

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 2-Chlor-4'-hydroxy-diphenylsulfon
• 英文别名: 4-(2-Chlorophenyl)sulfonylphenol
• CAS: 20804-16-4
• 化学式: C₁₂H₉ClO₃S
• 分子量: 268.721
• InChiKey: XRSGIRWZTZXROF-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.8
• 重原子数：
  17
• 可旋转键数：
  2
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  62.8
• 氢给体数：
  1
• 氢受体数：
  3

文献信息

• Use of an aromatic amorphous thermoplastic polymer
  申请人：AMOCO CORPORATION

  公开号：EP0113112A1

  公开（公告）日：1984-07-11

  Described herein are amorphous thermoplastic polymers containing units of the formula: wherein R is independently hydrogen, C1 to C6 alkyl, or C4 to C8 cycloalkyl, X' is independently wherein R1 and R2 are independently hydrogen or C1 to C9 alkyl; wherein R3 and R4 are independently hydrogen or C, to C8 alkyl; and a1 is an integer of 2 to 7; -S-, -0-, or a is an integer of 0 to 4 and n is independently an integer of 1 to 3. The units are attached to each other by an -O- bond. These polymers have an excellent combination of mechanical properties. They display high notched izod impact values, high heat distortion temperatures and excellent environmental stress crack resistance,

  此处描述的无定形热塑性聚合物含有式中的单元：其中 R 独立地为氢、C1 至 C6 烷基或 C4 至 C8 环烷基，X'独立地为 R1 和 R2 独立地为氢或 C1 至 C9 烷基，R3 和 R4 独立地为氢或 C 至 C8 烷基，a1 为 2 至 7 的整数，-S-、-0- 或 a 为 0 至 4 的整数，n 独立地为 1 至 3 的整数。 单元之间通过-O-键连接。 这些聚合物具有出色的机械性能组合。 它们显示出较高的缺口伊佐德冲击值、较高的热变形温度和出色的耐环境应力开裂性、
• Printed circuits
  申请人：AMOCO CORPORATION

  公开号：EP0130462A2

  公开（公告）日：1985-01-09

  Described herein is a composite structure comprising (a) a solid dielectric support surface; (b) a layer or pathway comprising a thermoset resin and containing sufficient electrically conductive metal particles, in the configuration of at least an electric circuit element, to provide desired properties and preferably to satisfy the Soldering Standard Test (hereinafter defined) and preferably to provide an electric circuit element having a low surface resistivity of 0.1 ohm per square or less. Also described are inks for printed circuit devices, circuit transfer means, and methods for making the same.

  本文描述的是一种复合结构，包括(a)固体电介质支撑表面；(b)由热固性树脂组成的层或通路，其中含有足够的导电金属颗粒，至少具有电路元件的结构，以提供所需的性能，最好能满足焊接标准测试（以下定义），最好能提供具有每平方 0.1 欧姆或更小的低表面电阻率的电路元件。此外，还介绍了用于印刷电路装置的油墨、电路传输装置以及制造方法。
• Cookware made from polyarylethersulfone
  申请人：AMOCO CORPORATION

  公开号：EP0127852A1

  公开（公告）日：1984-12-12

  Described herein is cookware made from a select polyarylethersulfone. The cookware can be used in essentially all cooking oven applications. Also described is a composition suitable for making cookware wherein the composition contains greater than 50 weight percent of the polyarylethersulfone.

  本文所描述的是由精选聚芳醚砜制成的炊具。这种炊具基本上可用于所有烹饪烤箱。此外，还介绍了一种适用于制造炊具的组合物，其中组合物中聚芳醚砜的含量大于 50%。
• Polyarylethersulfone containing blends
  申请人：AMOCO CORPORATION

  公开号：EP0133907A1

  公开（公告）日：1985-03-13

  Described herein are molding compositions comprising a select polyarylethersulfone and a thermoplastic polymer selected from a polyarylate, a polyester, and a polycarbonate, or mixtures thereof. These compositions have a good balance of mechanical properties and improved environmental stress crack resistance.

  本文描述的模塑组合物包含一种精选的聚芳醚砜和一种热塑性聚合物（选自聚芳酯、聚酯和聚碳酸酯或它们的混合物）。这些组合物具有良好的机械性能平衡和更好的抗环境应力开裂性能。
• Thermally resistant cookware
  申请人：AMOCO CORPORATION

  公开号：EP0166243A2

  公开（公告）日：1986-01-02

  Described herein is improved thermally resistant cookware formed from a thermoplastic material, said cookware comprising a tray having side walls with a peripheral flange extending around the upper edges of at least a portion thereof and which is covered by a metal foil or a thermoplastic resin sheet/metal foil laminate.

  本文描述的是由热塑性材料制成的改进型耐热炊具，所述炊具包括一个托盘，该托盘具有侧壁，侧壁至少有一部分的上边缘具有外围凸缘，该凸缘由金属箔或热塑性树脂板/金属箔层压板覆盖。