9-(5-Hydroxy-pentyl)-fluoren | 3952-44-1

• 分子结构分类: 有机化合物 - 苯类化合物 - 芴
• 英文名称: 9-(5-Hydroxy-pentyl)-fluoren
• 英文别名: 5-(9H-fluoren-9-yl)pentan-1-ol
• CAS: 3952-44-1
• 化学式: C₁₈H₂₀O
• 分子量: 252.356
• InChiKey: OVFJFZMEMYNUDR-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  4.5
• 重原子数：
  19
• 可旋转键数：
  5
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.33
• 拓扑面积：
  20.2
• 氢给体数：
  1
• 氢受体数：
  1

反应信息

• 作为反应物：
  描述：

  9-(5-Hydroxy-pentyl)-fluoren 在 sodium hydroxide 、 偶氮二甲酸二异丙酯 、 三苯基膦 作用下， 以 四氢呋喃 、 甲醇 为溶剂， 反应 12.5h， 生成 4-[5-(9H-fluoren-9-yl)pentoxy]benzoic acid
  参考文献：
  名称：

  Fluorenylalkanoic and Benzoic Acids as Novel Inhibitors of Cell Adhesion Processes in Leukocytes

  摘要：

  A series of fluoren-9-ylalkanoic and alkylbenzoic acids was prepared as simplified analogues of a previously reported series of antiinflammatory agents which act to inhibit neutrophil recruitment into inflamed tissue. The previous compounds (''leumedins'') contained (alkoxycarbonyl)amino or benzoic acid moieties tethered to a fluorene ring. This functionality was replaced with simple structural elements. The new compounds were, in general, found to be more potent than the earlier series at inhibiting adherence of neutrophils to serum-coated wells or endothelial cells in vitro. Compound 9 was approximately 10-fold more potent than the previously reported FMOC-phenylalanine, of which it is an analogue. Similarly, compound 19 was superior in potency to its first generation progenitor, NPC 16570. The new compounds were shown to inhibit neutrophil adherence under conditions in which adherence is mediated by Mac-1 (CD11b/CD18) and LFA-1 (CD11a/CD18); they thus appear to target beta(2)-integrins in their antiadhesion activity. These compounds provide a departure point for the further development of new cell adhesion inhibitors which should exhibit enhanced potency and a more selective mode of action.

  DOI：

  10.1021/jm00010a009

文献信息

• Resine Composition For Printed Circuit Board And Composite Substrate And Copper Laminates Using The Same
  申请人：KIM In Wook

  公开号：US20090004484A1

  公开（公告）日：2009-01-01

  Disclosed is a resin composition for a PCB, the composition including: (a) a polyphenylene ether resin modified via a redistribution reaction of polyphenylene ether in the presence of 9,9-bis(hydroxyaryl)fluorene or 9,10-dihydro-9-oxa-10-(dihydroxyaryl)-10-phosphaphenanthrene 10-oxide; (b) a dicyclopentadiene epoxy resin represented by Formula 1; and (c) an alkylphenol aldehyde novolak curing agent represented by Formula 2, wherein, when the polyphenylene ether resin is modified via a redistribution reaction of the polyphenylene ether in the presence of 9,9-bis(hydroxyaryl)fluorene, the composition further includes (d) a brominated epoxy resin. Also, a composite substrate and a copper laminate using the same are disclosed.