4,5-dimethylisophthalic acid | 4919-44-2

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 4,5-dimethylisophthalic acid
• 英文别名: 4,5-Dimethyl-isophthalsaeure；Methyl-2-methyl-5-carboxybenzoic acid；4,5-dimethylbenzene-1,3-dicarboxylic acid
• CAS: 4919-44-2
• 化学式: C₁₀H₁₀O₄
• 分子量: 194.187
• InChiKey: CPSSMIFTUQKPSF-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1.7
• 重原子数：
  14
• 可旋转键数：
  2
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.2
• 拓扑面积：
  74.6
• 氢给体数：
  2
• 氢受体数：
  4

文献信息

• MODIFIER FOR AROMATIC POLYESTER AND AROMATIC POLYESTER RESIN COMPOSITION COMPRISING THE SAME
  申请人：TABATA Masayoshi

  公开号：US20110224343A1

  公开（公告）日：2011-09-15

  The present invention provides a modifier for aromatic polyesters which enhances the melt fluidity of aromatic polyesters without a significant decrease in the heat resistance of the aromatic polyesters, and an aromatic polyester resin composition including the modifier for aromatic polyesters. The present invention relates to a modifier for aromatic polyesters comprising polyhydric phenol residues and residues of aromatic polycarboxylic acid, acid halide or acid anhydride thereof, and the modifier comprises a material having a structure composed of a first residue selected from the group consisting of divalent residues represented by Formula (I): —Ar—W 1 x —Ar— and by Formula (II): —Ar—, the first residues being bonded to two identical or different second residues selected from the group consisting of monovalent residues represented by Formula (III): and monovalent residues represented by Formula (IV): —O—C(O)—R 7 —.

  本发明提供了一种用于芳香族聚酯的改性剂，可以增强芳香族聚酯的熔融流动性，而不明显降低芳香族聚酯的耐热性，以及包括该改性剂的芳香族聚酯树脂组合物。本发明涉及一种用于芳香族聚酯的改性剂，包括多羟基酚残基和芳香族多羧酸、酸卤或其酸酐残基，该改性剂包括具有以下结构的材料：第一残基，选择自由式(I)所代表的二价残基：—Ar—W1x—Ar—和自由式(II)所代表的：—Ar—，第一残基与选择自由式(III)所代表的单价残基：和自由式(IV)所代表的单价残基：—O—C(O)—R7—的两个相同或不同的第二残基结合。
• Fluorinated Dicarboxylic Acid Derivative and Polymer Obtained Therefrom
  申请人：Isono Yoshimi

  公开号：US20110301305A1

  公开（公告）日：2011-12-08

  According to the present invention, a polymer is obtained by polycondensation of a fluorinated dicarboxylic acid derivative of the general formula (M-1) or an acid anhydride of the fluorinated dicarboxylic acid with a polyfunctional compound having two to four reactive groups corresponding in reactivity to carbonyl moieties of the fluorinated dicarboxylic acid derivative or acid anhydride. [Chem. 134] AOCF 2 C-Q-CF 2 COA′  (M-1) In the above formula, Q represents a divalent organic group having a substituted or unsubstituted aromatic ring; and A and A′ each independently represent an organic group. This polymer exhibits a sufficiently low dielectric constant for use as a semiconductor protection film and has the capability of forming a film at a relatively low temperature of 250° C. or lower.

  根据本发明，通过将通式(M-1)的含氟二羧酸衍生物或含氟二羧酸酸酐与具有与含氟二羧酸衍生物或酸酐的羰基部分相对应的两到四个反应性基团的多官能化合物进行聚合缩合反应，可以得到一种聚合物。[Chem. 134]AOCF2C-Q-CF2COA′  (M-1)在上述公式中，Q代表具有取代或未取代芳香环的二价有机基团; A和A'各自独立地表示有机基团。该聚合物表现出足够低的介电常数，可用作半导体保护膜，并具有在相对较低的温度下（250℃或更低）形成膜的能力。
• INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION
  申请人：Ono Kazuo

  公开号：US20100179250A1

  公开（公告）日：2010-07-15

  It is to improve the storage stability of a sealant, to retain the flowability of the sealant when sealing, and to achieve an effective curing rate of the sealant by heating to be applicable as a sealant for delicate semiconductors. It is an epoxy resin composition for sealing a semiconductor, comprising the following component (A) and component (B). (A) an epoxy resin, (B) a clathrate complex comprising (b1) an aromatic carboxylic acid compound, and (b2) at least one imidazole compound represented by formula (II) (wherein R 2 represents a hydrogen atom, etc.; R 3 to R 5 represent a hydrogen atom, etc.).

  这是为了改善密封剂的储存稳定性，保持密封时密封剂的流动性，并通过加热实现密封剂的有效固化速率，以适用于精细半导体的密封剂。它是一种用于密封半导体的环氧树脂组合物，包括以下组分（A）和组分（B）。（A）环氧树脂，（B）包括（b1）芳香羧酸化合物和（b2）至少一种由式（II）表示的咪唑化合物的笼形复合物（其中R2表示氢原子等；R3至R5表示氢原子等）。
• AROMATIC POLYESTER
  申请人：Muroran Institute of Technology

  公开号：EP2479203A1

  公开（公告）日：2012-07-25

  The present invention provides an aromatic polyester which is substantially free from the occurrence of coloration and retains significantly high transparency even after being thermally processed at high temperature and which has high flowability. The aromatic polyester contains a polyhydric phenol residue and a residue of any one of aromatic polycarboxylic acid, halide thereof, and anhydride thereof, and terminals of the aromatic polyester have a structure represented by the formula -C(O)-R. The aromatic polyester has an end-capping rate of 90% or higher and a weight average molecular weight (Mw) ranging from 3,000 to 1,000,000.

  本发明提供了一种芳香族聚酯，该聚酯基本上不会发生着色，即使在高温热加工后仍能保持明显的高透明度，并且具有高流动性。芳香族聚酯含有多羟基苯酚残留物和芳香族多羧酸、其卤化物和其酸酐中任意一种的残留物，芳香族聚酯的端基具有式 -C(O)-R 所代表的结构。芳香族聚酯的端盖率为 90% 或更高，重量平均分子量（Mw）为 3,000 至 1,000,000 之间。
• COMPOSITION FOR FORMATION OF CURED EPOXY RESIN, AND CURED PRODUCTS THEREOF
  申请人：Nippon Soda Co., Ltd.

  公开号：EP2489689A1

  公开（公告）日：2012-08-22

  An object of the present invention is to provide a composition for the formation of a cured epoxy resin, wherein the composition can suppress a curing reaction at a low temperature to thereby enhance one-pack stability, and can also be subjected to a heating treatment to thereby effectively cure a resin. The present invention provides a composition for the formation of a cured epoxy resin, the composition comprising the following components (A), (B) and (C): (A) an epoxy resin; (B) a clathrate compound of a carboxylic acid derivative represented by formula (I):         R(COOH)n     (I); and an imidazole compound represented by formula (II); and (C) a tetrakisphenol type compound represented by formula (III).

  本发明的目的是提供一种用于形成固化环氧树脂的组合物，其中该组合物可以在低温下抑制固化反应，从而提高单包稳定性，还可以进行加热处理，从而有效地固化树脂。本发明提供了一种用于形成固化环氧树脂的组合物，该组合物包括以下组分（A）、（B）和（C）： (A) 环氧树脂； (B) 由式(I)代表的羧酸衍生物的凝块化合物： R(COOH)n (I)； 和式 (II) 所代表的咪唑化合物；以及 (C) 式 (III) 所代表的四联酚型化合物。