3,3'-diamino-4,4'-dicarboxydiphenylsulfone | 22437-97-4

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 3,3'-diamino-4,4'-dicarboxydiphenylsulfone
• 英文别名: 2-Amino-4-(3-amino-4-carboxyphenyl)sulfonylbenzoic acid
• CAS: 22437-97-4
• 化学式: C₁₄H₁₂N₂O₆S
• 分子量: 336.325
• InChiKey: KYACBXOQPZLDPV-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1.5
• 重原子数：
  23
• 可旋转键数：
  4
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  169
• 氢给体数：
  4
• 氢受体数：
  8

文献信息

• Photosensitive resin composition and photosensitive films and laminates made by using the same
  申请人：——

  公开号：US20040265731A1

  公开（公告）日：2004-12-30

  A photosensitive resin composition of the present invention contains a (A) soluble polyimide and a (b) (meth)acrylic compound, the (A) soluble polyimide being soluble in an organic solvent and being synthesized by using an acid dianhydride component and at least one of a diamine component containing a siloxane structure or an aromatic ring structure, and a diamine component having, in its structure, a hydroxyl group a carboxyl group or a carbonyl group, and the (B) (meth)acrylic compound having at least one carbon-carbon double bond, and preferably contains at least one of a (C) photo reaction initiator and a (D) fire retardant. With this arrangement, the photosensitive resin composition of the present invention is capable of having excellent properties. Especially, the photosensitive resin composition of the present invention is so excellently useful that it can be used for electronic parts and the like.

  本发明的光敏树脂组合物包含(A)可溶性聚酰亚胺和(b)(甲基)丙烯酸化合物，其中(A)可溶性聚酰亚胺可在有机溶剂中溶解，并通过使用酸性二酐组分和至少一种含有硅氧烷结构或芳香环结构的二胺组分以及结构中具有羟基、羧基或羰基的二胺组分合成，(B)(甲基)丙烯酸化合物具有至少一个碳-碳双键，并且最好包含至少一个(C)光反应引发剂和(D)阻燃剂。通过这种安排，本发明的光敏树脂组合物具有优异的性能。特别是，本发明的光敏树脂组合物非常有用，可以用于电子零件等。
• Photosensitive resin composition capable of being developed with aqueous developer and photosensitive dry film resist, and use thereof
  申请人：Okada Koji

  公开号：US20060199920A1

  公开（公告）日：2006-09-07

  A photosensitive resin composition according to the present invention includes at least a base resin component (A) and a (meth)acryls compound (B), wherein the base resin component (A) is any one of: a polyimide resin (A-1) having at least either a hydroxyl group or a carboxyl group in its structure; a polyamide resin (A-2) having at least either a hydroxyl group or a carboxyl group in its structure; and photosensitive imide(meth)acrylsiloxaneoligomer (A-3). On this account, it is possible to realize characteristics such as (1) realization and improvement of water system developing property, (2) improvement of utility as an imidized film, (3) improvement of post-curing property, and (4) simplification of manufacture of a print wiring substrate. Thus, the photosensitive resin composition can be favorably used particularly in a photosensitive dry film resin, a laminate using the same, a print wiring substrate using the same, and the like.

  本发明提供的一种光敏树脂组合物包括至少一种基础树脂组分(A)和一种（甲基）丙烯酸化合物(B)，其中基础树脂组分(A)是以下任何一种：具有至少一个羟基或羧基的聚酰亚胺树脂(A-1)；具有至少一个羟基或羧基的聚酰胺树脂(A-2)；和光敏亚胺（甲基）丙烯酰基硅氧烷低聚物(A-3)。因此，可以实现特性，例如(1)实现和改善水系开发性能，(2)改善作为亚胺化膜的实用性，(3)改善后固化性能，以及(4)简化印刷线路基板的制造。因此，该光敏树脂组合物可以特别有利地用于光敏干膜树脂、使用相同的层压板、使用相同的印刷线路基板等。
• NOVEL POLYIMIDE PRECURSOR COMPOSITION AND USE THEREOF
  申请人：Fujihara Kan

  公开号：US20100132989A1

  公开（公告）日：2010-06-03

  An object of the present invention is to provide a polyimide precursor composition solution that (i) uses no siloxane diamine, (ii) is curable at low temperature (not more than 250° C.) and (iii) has low viscosity regardless of its high concentration, and a photosensitive resin composition, photosensitive resin film, a thermosetting resin composition, a polyimide insulating film, and a printed wiring board with an insulating film, each of which has good physical properties and is obtained by use of the polyimide precursor composition solution. The foregoing object is attained by using a polyimide precursor composition solution which includes at least a (A) urethane imide oligomer having a terminal carboxylic acid group and a (B) diamino compound and/or isocyanate compound.

  本发明的目的是提供一种聚酰亚胺前体组成物溶液，其(i)不使用硅氧烷二胺，(ii)可在低温（不超过250℃）下固化，且(iii)具有低粘度，无论其浓度如何，并提供一种光敏树脂组成物、光敏树脂膜、热固性树脂组成物、聚酰亚胺绝缘膜以及带有绝缘膜的印制电路板，每种产品都具有良好的物理性能，并通过使用聚酰亚胺前体组成物溶液获得。通过使用聚酰亚胺前体组成物溶液，该溶液至少包括(A)具有端羧基的聚氨酯酰亚胺寡聚体和(B)二胺化合物和/或异氰酸酯化合物，从而实现了上述目的。
• PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN SHEET, METHOD FOR PRODUCING HOLLOW STRUCTURE, AND ELECTRONIC COMPONENT
  申请人：Toray Industries, Inc.

  公开号：EP3933906A1

  公开（公告）日：2022-01-05

  A photosensitive resin composition according to the present invention is a photosensitive resin composition comprising (a) an alkali-soluble polyimide, (b) an unsaturated bond-containing compound, (c) a thermally crosslinkable compound, (d-1) a photobleaching photopolymerization initiator having the structure represented by general formula (1), and (d-2) a photopolymerization initiator having the structure represented by general formula (1) and having a molar extinction coefficient at a wavelength of 405 nm of at least 1000 L/(mol · cm). (In general formula (1), R1 represents a halogen atom, hydroxy group, carboxy group, nitro group, cyano group, -NR3R4, C1-20 monovalent hydrocarbon group, C1-20 acyl group, or C1-20 alkoxy group, and R3 and R4 each independently represent a hydrogen atom or C1-10 alkyl group, provided that at least a portion of the hydrogen atoms in the hydrocarbon group, acyl group, and alkoxy group may be substituted by a halogen atom, hydroxy group, carboxy group, nitro group, cyano group, or -NR3R4, and a hydrocarbon group present in the hydrocarbon group, in the acyl group, or in the alkoxy group may be interrupted by an ether bond, thioether bond, ester bond, thioester bond, amide bond, or urethane bond. R2 represents a C1-5 alkyl group. The symbol ∗ in the formula indicates bonding with a neighboring group via the ∗ moiety.) The photosensitive resin composition according to the present invention is also a photosensitive resin composition comprising (a) an alkali-soluble polyimide, (b) an unsaturated bond-containing compound, (c) a thermally crosslinkable compound, and (d) at least two species of oxime ester-type photopolymerization initiators. The photosensitive resin composition according to the present invention enables a high-sensitivity, high-quality photographic patterning of the cap portion of a hollow structure. A photosensitive resin sheet that uses the photosensitive resin composition according to the present

  根据本发明的一种光敏树脂组合物是一种光敏树脂组合物，它包括(a)碱溶性聚酰亚胺，(b)含不饱和键的化合物，(c)可热交联的化合物、(d-1) 具有通式（1）所代表结构的光漂白光聚合引发剂，和 (d-2) 具有通式（1）所代表结构的光聚合引发剂，其在 405 纳米波长处的摩尔消光系数至少为 1000 升/（摩尔-厘米）。(在通式（1）中，R1 代表卤素原子、羟基、羧基、硝基、氰基、-NR3R4、C1-20 单价烃基、C1-20酰基或 C1-20 烷氧基，而 R3 和 R4 各自独立地代表氢原子或 C1-10 烷基，条件是烃基中至少有一部分氢原子、烃基、酰基或烷氧基中的至少部分氢原子可被卤素原子、羟基、羧基、硝基、氰基或 -NR3R4 取代，烃基、酰基或烷氧基中的烃基可被醚键、硫醚键、酯键、硫酯键、酰胺键或聚氨酯键打断。R2 代表 C1-5 烷基。式中符号 ∗ 表示通过 ∗ 分子与邻近基团键合）。根据本发明的光敏树脂组合物也是一种光敏树脂组合物，它包含(a)碱溶性聚酰亚胺，(b)含不饱和键的化合物，(c)可热交联的化合物，和(d)至少两种肟酯类光聚合引发剂。根据本发明的光敏树脂组合物可以对中空结构的帽部进行高灵敏度、高质量的照相图案化。使用本发明光敏树脂组合物的光敏树脂片材
• Conductive-layer-integrated flexible printed circuit board
  申请人：Kaneka Corporation

  公开号：US10045433B2

  公开（公告）日：2018-08-07

  The present invention provides a conductive-layer-integrated flexible printed circuit board that has excellent electrical insulation reliability and that prevents the electrically conductive layer from being detached during a reflow process. The conductive-layer-integrated flexible printed circuit board includes: (A) an electromagnetic-shielding conductive layer; (B) an insulator film; and (C) a wiring-pattern-equipped film, (A) the electromagnetic-shielding conductive layer, (B) the insulator film, and (C) the wiring-pattern-equipped film being laminated in this order, (B) the insulator film containing at least (a) a binder polymer and (b) a black coloring agent having a reflective range within the infrared range.

  本发明提供了一种导电层集成柔性印刷电路板，它具有极佳的电气绝缘可靠性，并能防止导电层在回流焊过程中脱落。导电层集成柔性印刷电路板包括(A)电磁屏蔽导电层；(B)绝缘体薄膜；和(C)布线图案薄膜，(A)电磁屏蔽导电层、(B)绝缘体薄膜和(C)布线图案薄膜依次层叠，(B)绝缘体薄膜至少含有(a)粘合剂聚合物和(b)黑色着色剂，其反射范围在红外线范围内。