1,2-Phenylene dicyanate | 62351-39-7

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 1,2-Phenylene dicyanate
• 英文别名: (2-cyanatophenyl) cyanate
• CAS: 62351-39-7
• 化学式: C₈H₄N₂O₂
• 分子量: 160.13
• InChiKey: SMTQKQLZBRJCLI-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1.7
• 重原子数：
  12
• 可旋转键数：
  2
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  66
• 氢给体数：
  0
• 氢受体数：
  4

文献信息

• [EN] BUTADIEN2,3-DIYL LINKED DI-DOPO DERIVATIVES AS FLAME RETARDANTS<br/>[FR] DÉRIVÉS DE DI-DOPO LIÉS OAR BUTADIÈN-2,3-DIYLE EN TANT QUE RETARDATEURS DE FLAMME
  申请人：ALBEMARLE CORP

  公开号：WO2014179688A1

  公开（公告）日：2014-11-06

  Disclosed are novel, halogen-free flame-retardants derived from 9,10-Dihydro-9-Oxa-10-Phosphaphenantrene-10-oxide (DOPO) of the structure below: This invention also relates to the use of the halogen free DOPO derived compositions as flame-retardants in polymers, and a process of preparing the above compounds by reacting a formula A compound with a formula B compound:

  本发明涉及从下面结构的9,10-二氢-9-氧-10-磷杂菲-10-氧化物（DOPO）衍生的新型无卤素阻燃剂：该发明还涉及将无卤素DOPO衍生组合物用作聚合物中的阻燃剂，并通过将式A化合物与式B化合物反应制备上述化合物的方法。
• METHOD FOR PRODUCING CYANOGEN-HALIDE, CYANATE ESTER COMPOUND AND METHOD FOR PRODUCING THE SAME, AND RESIN COMPOSITION
  申请人：MITSUBISHI GAS CHEMICAL COMPANY, INC.

  公开号：US20150299110A1

  公开（公告）日：2015-10-22

  A method for efficiently producing a cyanogen halide with suppressed side effects, and a method for producing a high-purity cyanate ester compound at a high yield includes contacting a halogen molecule with an aqueous solution containing hydrogen cyanide and/or a metal cyanide, so that the hydrogen cyanide and/or the metal cyanide is allowed to react with the halogen molecule in the reaction solution to obtain the cyanogen halide, wherein more than 1 mole of the hydrogen cyanide or the metal cyanide is used based on 1 mole of the halogen molecule, and when an amount of substance of an unreacted hydrogen cyanide or an unreacted metal cyanide is defined as mole (A) and an amount of substance of the generated cyanogen halide is defined as mole (B), the reaction is terminated in a state in which (A):(A)+(B) is between 0.00009:1 and 0.2:1.

  一种用于高效生产抑制副作用的氰卤化物，以及以高收率生产高纯度氰酸酯化合物的方法包括将卤素分子与含有氢氰酸和/或金属氰化物的水溶液接触，使得氢氰酸和/或金属氰化物与卤素分子在反应溶液中发生反应以获得氰卤化物，其中基于1摩尔卤素分子使用超过1摩尔的氢氰酸或金属氰化物，当未反应的氢氰酸或未反应的金属氰化物的物质量定义为摩尔(A)，生成的氰卤化物的物质量定义为摩尔(B)，反应在(A)：(A)+(B)介于0.00009:1和0.2:1之间的状态中终止。
• Reworkable thermosetting resin composition
  申请人：Klemarczyk Philip T.

  公开号：US20080214840A1

  公开（公告）日：2008-09-04

  This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as CSPs, BGAs, LGAs and the like, each of which having a semiconductor chip, such as LSI, on a carrier substrate. The compositions of this invention are reworkable when subjected to appropriate conditions.

  这项发明涉及热固性树脂组合物，适用于安装在电路板上的半导体器件，如CSPs、BGAs、LGAs等，每个器件都有一个半导体芯片，如LSI，安装在载体基板上。本发明的组合物在适当条件下可重复加工。
• Reworkable epoxidized 1-(cyclo) alkenyl ether/polycarboxylic acid product
  申请人：——

  公开号：US20040102544A1

  公开（公告）日：2004-05-27

  The present invention discloses reworkable epoxy compositions suitable for encapsulation of and underfill for electronic components comprising (a) a curable epoxy component which is the reaction product of an epoxidized 1-alkenyl ether or 1-cycloalkenyl ether and a polycarboxylic acid, the reaction product being substantially free of unreacted acid or acid impurities; and (b) a curing agent for the epoxy component, wherein the reaction products of the epoxy composition are reworkable. The cured epoxy compositions of this invention contain thermally labile weak &agr;-alkoxy ester linkages which provide for the reworkable aspect of the invention.

  本发明揭示了适用于电子元件封装和下填的可重复加工环氧组合物，包括（a）可固化的环氧组分，其是环氧化的1-烯基醚或1-环烯基醚和多羧酸的反应产物，反应产物基本上不含未反应的酸或酸杂质；以及（b）用于环氧组分的固化剂，其中环氧组合物的反应产物是可重复加工的。本发明的固化环氧组合物包含热不稳定的弱α-烷氧酯键，这提供了本发明可重复加工的方面。
• Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent
  申请人：——

  公开号：US20030073770A1

  公开（公告）日：2003-04-17

  This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as CSPs, BGAs, LGAs and the like, each of which having a semiconductor chip, such as LSI, on a carrier substrate. The compositions of this invention are reworkable when subjected to appropriate conditions.

  本发明涉及热固性树脂组合物，可用于将半导体器件（如CSP、BGA、LGA等）安装在电路板上，每个器件都有一个载体基板上的半导体芯片（如LSI）。本发明的组合物在适当条件下可进行重复加工。