3.4-Dicarboxy-diphenylamin | 106321-13-5

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 3.4-Dicarboxy-diphenylamin
• 英文别名: 4-Anilinophthalic acid
• CAS: 106321-13-5
• 化学式: C₁₄H₁₁NO₄
• 分子量: 257.246
• InChiKey: UOOHZQYCDDCWIS-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.3
• 重原子数：
  19
• 可旋转键数：
  4
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  86.6
• 氢给体数：
  3
• 氢受体数：
  5

文献信息

• Low thermal expansion resin material for a wiring insulating film.
  申请人：HITACHI, LTD.

  公开号：EP0133533A2

  公开（公告）日：1985-02-27

  A resin material comprising a polyimide having as chemical structural unit at least one aromatic ring which can rotate around its molecular axis but has no flexibility at another direction, said polyimide being oriented at least at a uniaxial direction, has a low thermal expansion coefficient and can be shaped together with an inorganic material into one body to give a composite shaped article.

  一种由聚酰亚胺组成的树脂材料，其化学结构单元为至少一个芳香环，该芳香环可绕其分子轴旋转，但在另一个方向上没有柔韧性，所述聚酰亚胺至少在单轴方向上定向，具有较低的热膨胀系数，并可与无机材料塑合成一体，形成复合形状的物品。
• Process for producing metal-polyimide composite article
  申请人：HITACHI, LTD.

  公开号：EP0361461A2

  公开（公告）日：1990-04-04

  The present invention provides a process for producing a metal (2)-polyimide (3) composite material such as a wiring board. In production thereof, deterioration of polyamide film (3) due to oxidation during imidization of a polyimide precursor in contact with metal (2) such as copper or silver can be prevented. The present invention is characterized by using a polyimide precursor having an acidic functional group which is masked. Examples of the polyamide precursor are polyamic acid epoxy adducts, amido polyamic acids, silylated polyamic acids, etc.

  本发明提供了一种生产金属（2）-聚酰亚胺（3）复合材料（如线路板）的工艺。在生产过程中，可以防止聚酰亚胺前体在与铜或银等金属（2）接触的亚胺化过程中因氧化而导致聚酰胺薄膜（3）变质。本发明的特点是使用具有被掩蔽的酸性官能团的聚酰亚胺前体。聚酰胺前体的例子有聚酰胺酸环氧加合物、氨基聚酰胺酸、硅烷化聚酰胺酸等。
• Process for producing copper or silver/polyimide composite article
  申请人：HITACHI, LTD.

  公开号：EP0361462A2

  公开（公告）日：1990-04-04

  The present invention provides a process for producing a metal/polyimide composite article such as high-density wiring boards. This metal (2)/polyimide (3) composite article is produced by a method which comprises coating a polyamic acid alkyl ester represented by the following formula on a metallic film (2) and curing it: wherein R₁ and R₂ which may be identical or different each represents an organic group of 1 or more carbon atoms.

  本发明提供了一种生产金属/聚酰亚胺复合材料制品（如高密度线路板）的工艺。这种金属（2）/聚酰亚胺（3）复合材料制品的生产方法包括在金属膜（2）上涂覆由下式表示的聚酰胺酸烷基酯并使其固化： 其中 R₁ 和 R₂ 可以相同或不同，各自代表一个或多个碳原子的有机基团。
• A process of forming a patterned polyimide film and articles including such a film
  申请人：HITACHI, LTD.

  公开号：EP0389195A2

  公开（公告）日：1990-09-26

  A process of forming a patterned polyimide film includes the step of conversion of a polyimide precursor (4′) into polyimide (4). The improvement is imidizing the precursor by means of a chemical imidizing agent. Typically a film (4′) of polyimide precursor is formed on a substrate, and a mask (5′) which is negative with respect to the desired pattern is formed on the film. The film is contacted through the mask with a chemical imidizing agent to effect imidization of unmasked portions,thereby forming polyimide. The mask and masked portions of the film are removed, leaving the desired polyimide pattern (4). High temperatures and harmful etchants can be avoided.

  形成图案化聚酰亚胺薄膜的工艺包括将聚酰亚胺前体（4′）转化为聚酰亚胺（4）的步骤。改进的方法是用化学亚胺化剂使前体亚胺化。通常是在基底上形成一层聚酰亚胺前体薄膜（4′），然后在薄膜上形成与所需图案相关的负掩膜（5′）。薄膜通过掩膜与化学亚胺化剂接触，使未掩膜部分亚胺化，从而形成聚酰亚胺。去除薄膜上的掩膜和掩膜部分，留下所需的聚酰亚胺图案 (4)。可以避免高温和有害的蚀刻剂。
• A method for forming polyimide film by chemical vapor deposition
  申请人：HITACHI, LTD.

  公开号：EP0255037B1

  公开（公告）日：1992-12-09