Heat-resistant resin moldings having excellent abrasion resistance, surface smoothness, solvent resistance, durability, and adhesiveness to base material, which comprises a resin molding composed of at least 2 wt% of a structural unit represented by formula (I), (wherem R represents a hydrogen atom or a C1 to C20 alkyl, aryl or alicyclic group) and at most 98 wt% of an ethylenic monomer unit having provided thereon a hardened film of a crosslinkable resin material containing at least 30 wt% of at least one monomer having three or more (meth)acryloyloxy groups per molecule, and a process for their production are disclosed.
具有优异的耐磨性、表面平滑性、耐溶剂性、耐久性和与基体材料的粘合性的耐热
树脂模塑件,它包括由至少2 wt%的式(I)代表的结构单元(其中m R代表氢原子或C1至C20烷基、芳基或脂环基)和至多98 wt%的
乙烯基单体单元组成的
树脂模塑件,在该
树脂模塑件上提供了一层硬化膜,该硬化膜含有至少30 wt%的可交联
树脂材料、其中m R 代表氢原子或 C1 至 C20 烷基、芳基或脂环族基团)和至多 98 wt%的
乙烯基单体单元组成的
树脂模塑,其上有一层可交联
树脂材料硬化膜,该硬化膜含有至少 30 wt%的至少一种单体,该单体每个分子具有三个或更多的(甲基)
丙烯酰氧基,本发明还公开了其生产工艺。