Provided is a photocurable adhesive with which curing by direct irradiation of laser light is possible with almost no occurrence of surface carbonization and which is capable of satisfactory curing even when the coating thickness is increased. A photocurable adhesive, which is cured by irradiation of laser light, is provided. The curable adhesive contains an epoxy adhesive component, a light-absorbing component for thermal curing of the epoxy adhesive component by absorption of laser light, and an inorganic filler. The content of the light-absorbing component is 0.1 mass % or less. The pre-curing thermal conductivity of the photocurable adhesive is at least 0.2 W/m·K and the post-curing thermal conductivity is at least 0.5 W/m·K.
本发明提供了一种光固化粘合剂,可通过激光直接照射进行固化,几乎不会出现表面
碳化现象,即使增加涂层厚度也能达到令人满意的固化效果。本文提供了一种通过激光照射固化的光固化粘合剂。这种可固化粘合剂包含环
氧树脂粘合剂成分、通过吸收激光使环
氧树脂粘合剂成分热固化的光吸收成分和无机填料。光吸收成分的含量不超过 0.1 质量%。光固化粘合剂的固化前热导率至少为 0.2 W/m-K,固化后热导率至少为 0.5 W/m-K。