The present invention describes new types of metal complexes. Such compounds can be used as functional materials in a series of different types of applications which can be classified within the electronics industry in the widest sense. The inventive compounds are described by the formulae (1) and (4).
本发明描述了新型
金属配合物。这些化合物可以作为功能材料应用于各种不同类型的应用中,这些应用可以广义地归类为电子工业。这些创新化合物由式(1)和(4)描述。