the reaction between CuCl and NaEC5H3(R-3)N and were characterized by elemental analyses, uv-vis and NMR (1H, 13C) spectroscopy. The crystal structures of [CuSeC5H3(Me-3)N}]4 and [Cu(TeC5H4N)]4 revealed that the molecules are tetrameric in which each copper atom lies at the vertex of the tetrahedron and each face of the tetrahedron is capped by the bridging pyridylchalcogenolate ligand. Thermal behavior
通过CuCl和NAEa href=https://www.molaid.com/MS_8376 target="_blank">EC 5 H 3之间的反应分离出[Cu
EC 5 H 3(R-3)N}} 4(E / R =
SE / Me或Te / R; R = H或Me)络合物(R-3)N和通过元素分析,紫外可见和NMR(1 H,13 C)光谱进行表征。[Cu
SEa href=https://www.molaid.com/MS_8376 target="_blank">EC 5 H 3(Me-3)N}] 4和[Cu(T
EC 5 H 4 N)] 4的晶体结构揭示了分子是四聚体的,其中每个
铜原子位于四面体的顶点,四面体的每个面都被桥联的
吡啶硫属元素化物
配体封端。通过热重分析研究了这些配合物的热行为。取决于反应条件,热解同时产生
化学计量的和非
化学计量的
铜硫属元素化物,其通过XRD,EDX,
SEM,
TEM和SAED技术进行表征。这些前体用于制备纳米晶体和通过ACVD(气溶胶辅助
化学气相沉积)沉积
硫属
铜化物的薄膜。