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Benzoic acid, 4-amino-, reaction products with propylene oxide | 68442-73-9

中文名称
——
中文别名
——
英文名称
Benzoic acid, 4-amino-, reaction products with propylene oxide
英文别名
4-aminobenzoic acid;2-methyloxirane
Benzoic acid, 4-amino-, reaction products with propylene oxide化学式
CAS
68442-73-9
化学式
C10H13NO3
mdl
——
分子量
195.21
InChiKey
NUMCBOGLAKZOTP-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    1.37
  • 重原子数:
    14
  • 可旋转键数:
    1
  • 环数:
    2.0
  • sp3杂化的碳原子比例:
    0.3
  • 拓扑面积:
    75.8
  • 氢给体数:
    2
  • 氢受体数:
    4

文献信息

  • Method of making composite polishing layer for chemical mechanical polishing pad
    申请人:Rohm and Haas Electronic Materials CMP Holdings, Inc.
    公开号:US10011002B2
    公开(公告)日:2018-07-03
    A method of forming a chemical mechanical polishing pad composite polishing layer is provided, including: providing a first polishing layer component of a first continuous non-fugitive polymeric phase having a plurality of periodic recesses; discharging a combination toward the first polishing layer component at a velocity of 10 to 300 msec, filling the plurality of periodic recesses with the combination; allowing the combination to solidify in the plurality of periodic recesses forming a second non-fugitive polymeric phase giving a composite structure; and, deriving the chemical mechanical polishing pad composite polishing layer from the composite structure, wherein the chemical mechanical polishing pad composite polishing layer has a polishing surface on the polishing side of the first polishing layer component; and wherein the polishing surface is adapted for polishing a substrate.
    提供了一种形成化学机械抛光垫复合抛光层的方法,包括提供具有多个周期性凹槽的第一连续非逃逸聚合物相的第一抛光层组件;以 10 至 300 毫秒的速度向第一抛光层组件排放组合物,用组合物填充多个周期性凹槽;使组合物在多个周期性凹槽中凝固,形成具有复合结构的第二非逃逸聚合物相;以及,从复合结构中衍生出化学机械抛光垫复合抛光层,其中化学机械抛光垫复合抛光层在第一抛光层组件的抛光侧具有抛光面;且抛光面适于抛光基底。
  • Weather-resistant polishing pad
    申请人:HUBEI DINGLONG CHEMICAL CO., LTD.
    公开号:US10414025B2
    公开(公告)日:2019-09-17
    A weather-resistant polishing pad, including an upper layer operating for polishing, a buffer layer, and a transparent base. The buffer layer is disposed between the upper layer and the transparent base, and the upper layer, the buffer layer, and the transparent base are bonded via a pressure sensitive adhesive or an adhesive agent. The upper layer includes a weather-resistant polyurethane prepolymer, a curing agent, and a functional filler. The polyurethane prepolymer is a polymerization product of polyol and polyfunctional isocyanate. The polyfunctional isocyanate includes a first isocyanate containing no benzene ring, or the first isocyanate having an isocyanato group and a benzene group, and the isocyanato group and the benzene group are connected indirectly.
    一种耐候抛光垫,包括用于抛光的上层、缓冲层和透明基底。缓冲层位于上层和透明基底之间,上层、缓冲层和透明基底通过压敏胶或粘合剂粘合在一起。上层包括耐候性聚氨酯预聚物、固化剂和功能填料。聚氨酯预聚物是多元醇和多官能异氰酸酯的聚合产物。多官能团异氰酸酯包括不含苯环的第一异氰酸酯,或具有异氰酸酯基团和苯基团的第一异氰酸酯,且异氰酸酯基团和苯基团间接相连。
  • Polyurethane polishing pad
    申请人:Kulp Jo Mary
    公开号:US20050171225A1
    公开(公告)日:2005-08-04
    The polishing pad is suitable for planarizing at least one of semiconductor, optical and magnetic substrates. The polishing pad includes a cast polyurethane polymeric material formed with an isocyanate-terminated reaction product formed from a prepolymer reaction of a prepolymer polyol and a polyfunctional isocyanate. The isocyanate-terminated reaction product has 4.5 to 8.7 weight percent unreacted NCO; and the isocyanate-terminated reaction product is cured with a curative agent selected from the group comprising curative polyamines, curative polyols, curative alcoholamines and mixtures thereof. The polishing pad contains at least 0.1 volume percent filler or porosity.
    抛光垫适用于对半导体、光学和磁性基底中的至少一种进行平面化处理。抛光垫包括一种浇铸聚氨酯聚合物材料,该材料由预聚物多元醇和多官能异氰酸酯的预聚物反应生成的异氰酸酯封端反应产物形成。异氰酸酯封端反应产物具有 4.5 至 8.7 重量百分比的未反应 NCO;异氰酸酯封端反应产物用固化剂固化,固化剂选自固化剂多胺、固化剂多元醇、固化剂醇胺及其混合物。抛光垫含有至少 0.1 体积百分比的填料或孔隙。
  • METHOD FOR PRODUCING DAMPING POLYURETHANE CMP PADS
    申请人:Praxair Technology, Inc.
    公开号:EP2193008B1
    公开(公告)日:2012-05-23
  • SYSTEM AND METHOD FOR PRODUCING DAMPING POLYURETHANE CMP PADS
    申请人:Praxair Technology, Inc.
    公开号:EP2193008A1
    公开(公告)日:2010-06-09
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