Defectivity and process control of electroless deposition in microelectronics applications
申请人:Chen Qingyun
公开号:US20070062408A1
公开(公告)日:2007-03-22
Methods and compositions for electrolessly depositing Co, Ni, or alloys thereof onto a substrate in manufacture of microelectronic devices. Grain refiners, levelers, oxygen scavengers, and stabilizers for electroless Co and Ni deposition solutions.