To provide an interlayer filler composition which, in 3D lamination of semiconductor device chips, forms a highly thermally conductive filling interlayer simultaneously with the bonding of solder bumps or the like and lands between semiconductor device chips, a coating fluid and a process for producing a three-dimensional integrated circuit.
An interlayer filler composition for a three-dimensional integrated circuit, which comprises a resin (A) having a melt viscosity at 120°C of at most 100 Pa·s and a flux (B), the content of the flux (B) being at least 0.1 part by weight and at most 10 parts by weight per 100 parts by weight of the resin (A), or comprises a resin (A) having a melt viscosity at 120°C of at most 100 Pa·s and a coefficient of thermal conductivity of at least 0.2 W/mK, an inorganic filler (C) having a coefficient of thermal conductivity of at least 2 W/mK, a volume average particle size of at least 0.1 µm and at most 5 µm and a maximum volume particle size of at most 10 µm, and a curing agent (D) and/or a flux (B).
提供一种层间填料组合物,在半导体器件芯片的三维层压中,与焊料凸块或类似物的粘合同时形成高导热填料层,并在半导体器件芯片之间着地,还提供一种涂布液和一种生产三维集成电路的工艺。
一种用于三维集成电路的层间填充组合物,它包括在 120°C 时熔融粘度不超过 100 Pa-s 的
树脂 (A) 和助焊剂 (B),助焊剂 (B) 的含量至少为每 100 份
树脂 (A) 0.1 份(按重量计),至多为 10 份(按重量计),或包括在 120°C 时熔融粘度不超过 100 Pa-s 的
树脂 (A) 和导热系数至少为 0.2 W/mK 的
树脂 (A)、导热系数至少为 2 W/mK 的无机填料 (C)、体积平均粒径至少为 0.1 微米且最多为 5 微米且最大体积粒径最多为 10 微米的无机填料 (C),以及固化剂 (D) 和/或助焊剂 (B)。