申请人:THE BOEING COMPANY
公开号:EP0305882A2
公开(公告)日:1989-03-08
The solvent-resistance and thermal stability of polyamideimides of the general formulae:
or
is improved by capping the amideimides with a crosslinking functionality (Y) containing a residue selected from the group of:
wherein
R1 = lower alkyl, lower alkoxy, aryl, aryloxy, substituted alkyl, substituted aryl (either including hydroxyl or halo-substitutents), halogen, or mixtures thereof;
j = 0, 1, or 2;
G = -CH2-, -0-, -S-, -S02-, -SO-, -CO-, -CHR-, or -CR2-;
R = hydrogen, lower alkyl, or phenyl;
T = methallyl or allyl;
Me = methyl;
R2 = a trivalent organic radical; and
R32 = a divalent organic radical.
The amideimde oligomers may be linear or multidimensional, and can be processed into blends, prepregs, or composites. Methods of making these amideimides and intermediates useful in the syntheses are also described.
通式中的聚酰胺酰亚胺的耐溶剂性和热稳定性:
或
的聚酰胺酰亚胺的耐溶剂性和热稳定性:
其中
R1 = 低级烷基、低级烷氧基、芳基、芳氧基、取代的烷基、取代的芳基(包括羟基或卤代取代基)、卤素或它们的混合物;
j = 0、1 或 2;
G = -CH2-、-0-、-S-、-S02-、-SO-、-CO-、-CHR- 或 -CR2-;
R = 氢、低级烷基或苯基;
T = 甲基烯丙基或烯丙基;
Me = 甲基;
R2 = 三价有机基;以及
R32 = 二价有机基。
酰胺亚胺低聚物可以是线性或多维的,可以加工成混合物、预浸料或复合材料。此外,还介绍了制造这些酰胺亚胺的方法以及用于合成的中间体。