Benzaldehyde, 5-dodecyl-2-hydroxy-, oxime | 77635-32-6

• 分子结构分类: 有机化合物 - 苯类化合物 - 酚类
• 英文名称: Benzaldehyde, 5-dodecyl-2-hydroxy-, oxime
• 英文别名: 4-dodecyl-2-[(E)-hydroxyiminomethyl]phenol
• CAS: 77635-32-6
• 化学式: C₁₉H₃₁NO₂
• 分子量: 305.5
• InChiKey: UWGTVLYQSJNUFP-CAPFRKAQSA-N

物化性质

• 熔点：
  53-54℃
• 沸点：
  436.0±38.0 °C(Predicted)
• 密度：
  0.99

计算性质

• 辛醇/水分配系数(LogP)：
  7.5
• 重原子数：
  22
• 可旋转键数：
  12
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.63
• 拓扑面积：
  52.8
• 氢给体数：
  2
• 氢受体数：
  3

安全信息

• 海关编码：
  2928000090

反应信息

• 作为产物：
  描述：

  5-十二烷基-2-羟基苯甲醛 、 羟胺 以94%的产率得到
  参考文献：
  名称：

  STEPNIAK-BINIAKIEWICZ D., POL. J. CHEM., 1980, 54, NO 7-8, 1567-1571

  摘要：

  DOI：

文献信息

• Polishing systems
  申请人：Misra Sudhanshu

  公开号：US20090318063A1

  公开（公告）日：2009-12-24

  Described herein are polishing apparatus, polishing formulations, and polymeric substrates for use in polishing surfaces, and related methods. The apparatus, formulations, substrates, and methods may each be used in applications involving the polishing of metal and/or metal-containing surfaces such as semiconductor wafers. The apparatus, formulations, polymeric substrates, and related methods described herein may be used without abrasives, and in some instances, without mechanical friction of a pad surface against the surface to be polished. Therefore, defects on a polished surface due to such mechanical polishing processes may be reduced.
• Stripping Process
  申请人：Fujifilm Electronic Materials U.S.A., Inc.

  公开号：US20180136563A1

  公开（公告）日：2018-05-17

  This disclosure relates to a process for stripping an organic film on a patterned semiconductor substrate. The process includes treating the organic film with an aqueous stripper composition to remove the organic film in one step. The organic film includes at least a first layer and a second layer, the first layer has a dissolution rate of at most about 0.01 μ/min in a developer at 25° C., and the second layer has a dissolution rate of greater than about 0.01 μ/min in the developer at 25° C.
• US5100532A
  申请人：——

  公开号：US5100532A

  公开（公告）日：1992-03-31
• [EN] CLEANING COMPOSITION<br/>[FR] COMPOSITION DE NETTOYAGE
  申请人：FUJIFILM ELECTRONIC MAT USA INC

  公开号：WO2017023677A1

  公开（公告）日：2017-02-09

  This disclosure relates to a composition (e.g., a cleaning and/or stripping composition) containing (a) 0.5 - 25 percent by weight an alkaline compound; (b) 1 - 25 percent by weight an alcohol amine compound; (c) 0.1 - 20 percent by weight a hydroxylammonium compound; (d) 5 - 95 percent by weight an organic solvent; (e) 0.1 - 5 percent by weight a corrosion inhibitor compound; and (f) 2 -25 percent by weight water.
• STEPNIAK-BINIAKIEWICZ D., POL. J. CHEM., 1980, 54, NO 7-8, 1567-1571
  作者：STEPNIAK-BINIAKIEWICZ D.

  DOI：——

  日期：——