(3-hydroxyphenyl)triphenylphosphonium bromide | 844468-43-5

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: (3-hydroxyphenyl)triphenylphosphonium bromide
• 英文别名: triphenyl(3-hydroxyphenyl)phosphonium bromide；(3-Hydroxyphenyl)(triphenyl)phosphanium bromide；(3-hydroxyphenyl)-triphenylphosphanium;bromide
• CAS: 844468-43-5
• 化学式: Br*C₂₄H₂₀OP
• 分子量: 435.3
• InChiKey: TYCMLLCEOCOWGE-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1.02
• 重原子数：
  27
• 可旋转键数：
  4
• 环数：
  4.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  20.2
• 氢给体数：
  1
• 氢受体数：
  2

反应信息

• 作为反应物：
  描述：

  (3-hydroxyphenyl)triphenylphosphonium bromide 在 sodium hydroxide 作用下， 以 乙醇 为溶剂， 以99%的产率得到3-(triphenylphosphonio)phenolate
  参考文献：
  名称：

  Tetraarylphosphonium inner-salts (TAPIS) as both Lewis base catalyst and phase tag

  摘要：

  Tetraarylphosphonium inner-salts (TAPIS) have been designed, synthesized and verified as recyclable and reusable Lewis base catalysts. The resulted TAPIS catalyst has been successfully applied in Michael addition, cyanation and trifluoromethylation reactions. (C) 2017 Elsevier Ltd. All rights reserved.

  DOI：

  10.1016/j.tetlet.2017.06.015
• 作为产物：
  描述：

  间溴苯酚 、 三苯基膦 在 氯化镍 作用下， 以 水 、 乙二醇 为溶剂， 生成 (3-hydroxyphenyl)triphenylphosphonium bromide
  参考文献：
  名称：

  LATENT CATALYST FOR EPOXY RESIN, EPOXY RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE

  摘要：

  本发明提供了一种环氧树脂的潜在催化剂，包括：具有加速环氧树脂固化反应活性的阳离子基团；以及抑制固化反应加速活性的硅酸盐阴离子基团。还公开了一种包含潜在催化剂的环氧树脂组合物以及使用该环氧树脂组合物的半导体器件。

  公开号：

  US20090023840A1

文献信息

• Epoxy resin composition, process for providing latency to the composition and semiconductor device
  申请人：Akiyama Yoshihito

  公开号：US20060189721A1

  公开（公告）日：2006-08-24

  An epoxy resin composition which comprises an epoxy resin (A), a curing agent (B), a curing accelerator (C) and a component retarding curing of the epoxy resin (D) which is at least one component selected from components (a), (b) and (c) represented by general formulae [1], [2] and [3], respectively, a semiconductor device having a semiconductor element sealed by using the composition, and a process for providing latency to an epoxy resin composition. The epoxy resin exhibits excellent storage stability, excellent fluidity and curing property during sealing by molding and excellent resistance to soldering without forming cleavages or cracks by the soldering treatment at high temperatures in accordance with the lead-free soldering. An epoxy resin composition can be provided with latency by adjusting the amounts of the curing accelerator and the component for retarding curing. (a) An anion component represented by general formula [1]: (b) A compound represented by general formula [2]: (c) A silane compound represented by general formula [3]:

  一种环氧树脂组合物，包括环氧树脂（A）、固化剂（B）、固化促进剂（C）和至少选自由一组分（a）、（b）和（c）中的一种，该组分可以延缓环氧树脂固化（D），该组分分别由通式[1]、[2]和[3]表示。使用该组合物密封半导体元件的半导体器件，以及提供环氧树脂组合物潜伏期的方法。该环氧树脂具有优异的储存稳定性、流动性和在模压密封时的固化性能，以及在符合无铅焊接的高温焊接处理中，具有优异的抗焊接剪切和抗裂纹性能。通过调整固化促进剂和延缓固化组分的量，可以提供一种具有潜伏期的环氧树脂组合物。（a）由通式[1]表示的阴离子组分：（b）由通式[2]表示的化合物：（c）由通式[3]表示的硅烷化合物：
• Latent catalyst for epoxy resin, epoxy resin composition, and semiconductor device
  申请人：Horimoto Akihiro

  公开号：US20050075474A1

  公开（公告）日：2005-04-07

  The present invention provides a latent catalyst for epoxy resin, comprising: a cation moiety having an activity of accelerating curing reaction of epoxy resin; and a silicate anion moiety of suppressing the curing reaction-accelerating activity. Also disclosed are an epoxy resin composition comprising the latent catalyst and a semiconductor device using the epoxy resin composition.

  本发明提供了一种环氧树脂的潜在催化剂，包括：具有加速环氧树脂固化反应活性的阳离子基团；以及抑制固化反应加速活性的硅酸盐阴离子基团。此外，还公开了一种包含潜在催化剂的环氧树脂组合物和使用该环氧树脂组合物的半导体器件。
• Epoxy resin composition, process for providing latency to the composition and a semiconductor device
  申请人：Sumitomo Bakelite Co., Ltd.

  公开号：US07723444B2

  公开（公告）日：2010-05-25

  An epoxy resin composition which comprises an epoxy resin (A), a curing agent (B), a curing accelerator (C) and a component retarding curing of the epoxy resin (D) which is at least one component selected from components (a), (b) and (c) represented by general formulae [1], [2] and [3], respectively, a semiconductor device having a semiconductor element encapsulated by using the composition, and a process for providing latency to an epoxy resin composition. The epoxy resin exhibits excellent storage stability, excellent fluidity and curing property during encapsulating by molding and excellent resistance to soldering without forming cleavages or cracks by the soldering treatment at high temperatures in accordance with the lead-free soldering. An epoxy resin composition can be provided with latency by adjusting the amounts of the curing accelerator and the component for retarding curing. (a) An anion component represented by general formula [1]: (b) A compound represented by general formula [2]: (c) A silane compound represented by general formula [3]:

  一种环氧树脂组合物，包括环氧树脂（A）、固化剂（B）、固化促进剂（C）和至少一种抑制环氧树脂固化的组分（D），该组分至少包括通式[1]、[2]和[3]所表示的组分（a）、（b）和（c）中的至少一种。使用该组合物封装的半导体器件以及提供环氧树脂组合物潜伏期的方法。该环氧树脂表现出优异的储存稳定性、优异的流动性和在模塑封装时的固化性能，以及在符合无铅焊的高温焊接处理中，具有优异的耐焊接性，不会形成断裂或裂纹。通过调整固化促进剂和抑制固化组分的量，可以提供一种具有潜伏期的环氧树脂组合物。 （a）通式[1]所表示的阴离子组分： （b）通式[2]所表示的化合物： （c）通式[3]所表示的硅烷化合物：
• PROCESS FOR PRODUCING LATENT CATALYST AND EPOXY RESIN COMPOSITION
  申请人：Goh Yoshiyuki

  公开号：US20090234080A1

  公开（公告）日：2009-09-17

  An object of the invention is to provide a preparation process of a latent catalyst that can gives a latent catalyst, which can exert an excellent catalytic activity at the time of molding and therefore, can provide a resin composition having good curing property, fluidity and storage stability, in a short time in a high yield without mixing in ionic impurities. The present invention relates to a preparation process of a phosphonium silicate latent catalyst, comprising reacting (A) a proton donor represented by the following formula (1): [Chemical Formula 1] HY 1 -Z 1 -Y 2 H  (1) [wherein Y 1 and Y 2 may be the same or different and each represents a group resulting from a proton donating substituent through release of a proton, Z 1 represents a substituted or unsubstituted organic group which bonds to the proton donating substituents Y 1 H and Y 2 H, and two substituents Y 1 and Y 2 in the same molecule are capable of bonding to a silicon atom to form a chelate structure], (B) a trialkoxysilane compound and (D) a phosphonium salt compound represented by the following formula (2): [wherein R 1 , R 2 , R 3 and R 4 may be the same or different and each represents an organic group having a substituted or unsubstituted, aromatic or heterocyclic ring or represents a substituted or unsubstituted aliphatic group and X − represents a halide ion, a hydroxide ion or an anion resulting from a proton donating group through release of a proton], wherein the reaction is carried out in the presence of (C) a metal alkoxide compound.
• US7723444B2
  申请人：——

  公开号：US7723444B2

  公开（公告）日：2010-05-25