THERMOSETTING COMPOSITION FOR OPTICAL SEMICONDUCTOR, DIE BOND MATERIAL FOR OPTICAL SEMICONDUCTOR DEVICE, UNDERFILL MATERIAL FOR OPTICAL SEMICONDUCTOR DEVICE, SEALING AGENT FOR OPTICAL SEMICONDUCTOR DEVICE, AND OPTICAL SEMICONDUCTOR DEVICE
申请人:Sekisui Chemical Co., Ltd.
公开号:EP2017295A1
公开(公告)日:2009-01-21
To provide a thermosetting composition for an optical semiconductor which is highly transparent, is free-from decrease in thickness or discoloration of a cured product due to heat generation or light emitting of a light emitting device, is superior in heat resistance and lightfastness, and has excellent adhesion to a housing material or the like, a sealing agent for an optical semiconductor device and a die bond material for an optical semiconductor device using the same, and an optical semiconductor device obtained by using the thermosetting composition for an optical semiconductor, the sealing agent for an optical semiconductor, the die bond material for an optical semiconductor device and/or the underfill material for an optical semiconductor device.
A thermosetting composition for an optical semiconductor containing a silicone resin having a cyclic ether-containing groups and a thermosetting agent capable of reacting with said cyclic ether-containing group, wherein the silicone resin has, as the principal components, a structural unit expressed by the following formula (1) and a structural unit expressed by the following formula (2), the content of the structural unit expressed by the formula (1) is 0.6 to 0.95 (on a molar basis) and the content of the structural unit expressed by the formula (2) is 0.05 to 0.4 (on a molar basis) when total number of the structural units contained is taken as 1, and the content of the cyclic ether-containing group is 5 to 40 mol%:
[formula 1] (R1R2SiO2/2) (1)
and
[formula 2] (R3SiO3/2) (2)
in the formula (1) and (2), at least one of R1, R2 and R3 represents a cyclic ether-containing group, R1, R2 and R3 other than the cyclic ether-containing group represent hydrocarbon having 1 to 8 carbon atoms or fluoride thereof and they may be the same or may be different from one another and plural types of R1, R2 and R3 different from each other in a repeating unit in a silicone resin skeleton may be contained.
提供一种光学半导体用热固性组合物,该组合物具有高透明性,不会因发光器件发热或发光而导致固化物厚度减少或变色,具有优异的耐热性和耐光性,并且与外壳材料等具有优异的粘合性、光半导体器件用密封剂和使用该密封剂的光半导体器件用芯片结合材料,以及通过使用光半导体用热固性组合物、光半导体用密封剂、光半导体器件用芯片结合材料和/或光半导体器件用底部填充材料而获得的光半导体器件。
一种用于光学半导体的热固性组合物,含有一种具有含环醚基团的硅树脂和一种能与所述含环醚基团反应的热固剂,其中硅树脂的主要成分是下式(1)表示的结构单元和下式(2)表示的结构单元,下式(1)表示的结构单元的含量为 0.当所含结构单元总数为 1 时,式(1)表示的结构单元的含量为 0.6 至 0.95(摩尔基),式(2)表示的结构单元的含量为 0.05 至 0.4(摩尔基),含环醚基团的含量为 5 至 40 摩尔%:
[式 1] (R1R2SiO2/2) (1)
和
[式 2] (R3SiO3/2) (2)
在式(1)和(2)中,R1、R2 和 R3 中至少有一个代表含环醚基团,R1、R2 和 R3 除代表含环醚基团外,还代表具有 1 至 8 个碳原子的烃或其氟化物,它们可以相同,也可以互不相同,在硅树脂骨架的重复单元中可以包含互不相同的多种类型的 R1、R2 和 R3。