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Hexane-1,6-diamine;2-methylpentane-1,5-diamine;terephthalic acid | 123447-94-9

中文名称
——
中文别名
——
英文名称
Hexane-1,6-diamine;2-methylpentane-1,5-diamine;terephthalic acid
英文别名
——
Hexane-1,6-diamine;2-methylpentane-1,5-diamine;terephthalic acid化学式
CAS
123447-94-9
化学式
C20H38N4O4
mdl
——
分子量
398.5
InChiKey
GZWHUJGXUMQGQM-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    1.87
  • 重原子数:
    28
  • 可旋转键数:
    11
  • 环数:
    1.0
  • sp3杂化的碳原子比例:
    0.6
  • 拓扑面积:
    179
  • 氢给体数:
    6
  • 氢受体数:
    8

文献信息

  • Polyamide resin composition having high melt point and being excellent in anti-vibration property upon water absorption
    申请人:TOYOBO CO., LTD.
    公开号:US10072137B2
    公开(公告)日:2018-09-11
    The present invention provides a polyamide resin composition having high melt point which can produce a molded product having high anti-vibration property or, in other words, having very high resonance frequency and, in particular, being capable of retaining high resonance frequency even upon water absorption. A polyamide resin composition, comprising a polyamide resin (A) having melt point (Tm) of 290° C. to 350° C. and having crystallization temperature upon temperature rise (Tc1) of 80 to 150° C., and glass fibers (B) having cross-sectional area of 1.5 to 5.0×10−6 cm2, characterized in that, ratio by weight of the polyamide resin (A) to the glass fibers (B) [(A):(B)] is from 20:80 to 35:65, and that the polyamide resin (A) is a copolymerized polyamide consisting of 55 to 75 molar % of a constituent unit (a) obtained from an equimolar salt of hexamethylenediamine and terephthalic acid, and 45 to 25 molar % of a constituent unit (b) obtained from 11-aminoundecanoic acid or undecane lactam.
    本发明提供了一种具有高熔点的聚酰胺树脂组合物,该组合物可生产出具有高抗 振性或换言之具有极高共振频率的模制产品,特别是即使在吸水后仍能保持高共振频率。一种聚酰胺树脂组合物,包括熔点(Tm)为 290°C 至 350°C,升温后结晶温度 (Tc1)为 80°C 至 150°C的聚酰胺树脂(A)、和玻璃纤维 (B) 的横截面积为 1.5 至 5.0×10-6 cm2,其特征在于,聚酰胺树脂(A)与玻璃纤维(B)的重量比[(A):(B)]为 20:80 至 35:65,聚酰胺树脂(A)是一种共聚聚酰胺,由55至75摩尔%的由己二胺和对苯二甲酸的等摩尔盐得到的组成单元(a)和45至25摩尔%的由11-氨基十一烷酸或十一烷内酰胺得到的组成单元(b)组成。
  • POLYAMIDE RESIN COMPOSITION HAVING HIGH MELT POINT AND BEING EXCELLENT IN ANTI-VIBRATION PROPERTY UPON WATER ABSORPTION
    申请人:TOYOBO CO., LTD.
    公开号:US20160130424A1
    公开(公告)日:2016-05-12
    The present invention provides a polyamide resin composition having high melt point which can produce a molded product having high anti-vibration property or, in other words, having very high resonance frequency and, in particular, being capable of retaining high resonance frequency even upon water absorption. A polyamide resin composition, comprising a polyamide resin (A) having melt point (Tm) of 290° C. to 350° C. and having crystallization temperature upon temperature rise (Tc1) of 80 to 150° C., and glass fibers (B) having cross-sectional area of 1.5 to 5.0×10 −6 cm 2 , characterized in that, ratio by weight of the polyamide resin (A) to the glass fibers (B) [(A):(B)] is from 20:80 to 35:65, and that the polyamide resin (A) is a copolymerized polyamide consisting of 55 to 75 molar % of a constituent unit (a) obtained from an equimolar salt of hexamethylenediamine and terephthalic acid, and 45 to 25 molar % of a constituent unit (b) obtained from 11-aminoundecanoic acid or undecane lactam.
  • SEMI-AROMATIC POLYAMIDE RESIN COMPOSITION AND METAL-PLATED MOLDED BODY
    申请人:TOYOBO CO., LTD.
    公开号:US20220411581A1
    公开(公告)日:2022-12-29
    To provide a semi-aromatic polyamide resin composition having excellent good plating properties, low water absorption properties, and solder reflow resistance. A semi-aromatic polyamide resin composition of the present invention comprises: 10 to 200 parts by mass of an inorganic filler (B) and 2 to 30 parts by mass of a toughness improver (C) based on 100 parts by mass of a semi-aromatic polyamide (A), wherein the semi-aromatic polyamide resin (A) satisfies the following (a) and (b): (a) a melting point (Tm) measured by differential scanning calorimetry (DSC) is 280° C. or higher; and (b) an equilibrium water absorption rate at 80° C. and 95% RH is 3.5% or less.
  • US5302691A
    申请人:——
    公开号:US5302691A
    公开(公告)日:1994-04-12
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