申请人:Ajinomoto Co., Inc.
公开号:EP0950677A2
公开(公告)日:1999-10-20
Herein are disclosed a latent curing agent for epoxy resin, comprising a reaction product obtainable by allowing (A) an epoxy compound having more than one (1) epoxy groups on the average in the molecule and (B) a compound having in the molecule both a tertiary amino group and at least one functional group selected from the group consisting of OH group, SH group, NH group, NH2 group, COOH group and CONHNH2 group, to react on each other in the presence of 0.05-5.0 equivalents of water per 1 equivalent of the epoxy group of Compound (A), and a curable epoxy resin composition comprising (y) such curing agent and (x) an epoxy compound having more than one epoxy groups on the average in the molecule. The epoxy resin composition is an epoxy resin composition excellent in storage stability and rapidly curable at low temperatures.
Herein is also disclosed a latent curing agent for epoxy resin, comprising a reaction product obtainable by allowing(a) an alicyclic epoxy compound having 2 or more epoxy groups in the molecule; (b) a compound having in the molecule both a tertiary amino group and at least one functional group selected from the group consisting of OH group, SH group, NH group, NH2 group, COOH group and CONHNH2 group; and (c) a compound having in the molecule at least one functional group selected from the group consisting of NH2 group and CONHNH2 group or in the molecule at least 2 functional groups selected from the group consisting of OH group, SH group, NH group and COOH group (provided that a compound having an epoxy group or tertiary amino group in the molecule is excluded), to react on one another, which, when incorporated into an epoxy compound, gives a curable epoxy resin composition rapidly curable at low temperatures, excellent in heat resistance, electrical reliability, etc. and therefore, suitable in the electronics field such as encapsulants for semiconductor, anisotropic conductive films, conducting composites, etc.
本发明公开了一种用于环氧树脂的潜伏固化剂,该固化剂包括通过使(A)分子中平均具有一(1)个以上环氧基团的环氧化合物和(B)分子中同时具有叔氨基和至少一个选自OH基团、SH基团、NH基团、NH2基团、COOH基团和CONHNH2基团的官能团的化合物在0.05-5.0当量水/1当量化合物(A)的环氧基团,以及一种可固化的环氧树脂组合物,该组合物包含(y)此类固化剂和(x)分子中平均具有一个以上环氧基团的环氧化合物。该环氧树脂组合物是一种储存稳定性极佳且可在低温下快速固化的环氧树脂组合物。
本发明还公开了一种环氧树脂的潜在固化剂,该固化剂由以下物质反应生成:(a) 分子中含有 2 个或 2 个以上环氧基团的脂环族环氧化合物;(b) 分子中含有叔氨基和至少一个官能团的化合物,这些官能团选自由 OH 基团、SH 基团、NH 基团、NH2 基团、COOH 基团和 CONHNH2 基团组成的组;(c) 分子中含有至少一个选自 NH2 基团和 CONHNH2 基团的官能团的化合物,或分子中含有至少两个选自 OH 基团、SH 基团、NH 基团和 COOH 基团的官能团的化合物(但分子中含有环氧基团或叔胺基的化合物除外),这些官能团相互反应,当加入环氧化合物中时,产生一种可固化环氧树脂组合物,可在低温下快速固化,具有优异的耐热性和电气可靠性等。因此适用于电子领域,如半导体封装材料、各向异性导电薄膜、导电复合材料等。