3,4,4'-triaminodiphenyl sulfone | 17828-44-3

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 3,4,4'-triaminodiphenyl sulfone
• 英文别名: 4-(4-aminophenylsulfonyl)benzene-1,2-diamine；4-sulfanilyl-o-phenylenediamine；4-Sulfanilyl-o-phenylendiamin；4-[(4-Aminophenyl)sulfonyl]-1,2-benzenediamine；4-(4-aminophenyl)sulfonylbenzene-1,2-diamine
• CAS: 17828-44-3
• 化学式: C₁₂H₁₃N₃O₂S
• 分子量: 263.32
• InChiKey: LMCLQTHHLNHUPN-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  0.3
• 重原子数：
  18
• 可旋转键数：
  2
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  121
• 氢给体数：
  3
• 氢受体数：
  5

反应信息

• 作为产物：
  描述：

  2-nitro-4-(4-nitro-benzenesulfonyl)-aniline 在 盐酸 、 tin(ll) chloride 作用下， 生成 3,4,4'-triaminodiphenyl sulfone
  参考文献：
  名称：

  SULFONES. I. THE ISOMERIC X,X'-DIAMINODIPHENYL SULFONES

  摘要：

  DOI：

  10.1021/jo01148a027

文献信息

• Two stage melt polymerization process for making polybenzimidazoles
  申请人：HOECHST CELANESE CORPORATION

  公开号：EP0705863A1

  公开（公告）日：1996-04-10

  The present invention is directed to a two stage melt polymerization process for producing polybenzimidazoles and aromatic amide polymers. The process includes the steps of: 1) providing a mixture of an aromatic amine, a dicarboxylic component, and a foaming agent; 2) heating the mixture to a condensation polymerization temperature in a first stage under a substantially oxygen-free atmosphere; 3) maintaining the mixture at that temperature, but in no event at a temperature greater than 350°C while allowing a friable foam to form; 4) cooling the foam; 5) crushing the foam to obtain a prepolymer; and 6) heating the prepolymer in a second stage, to a temperature in excess of the highest temperature employed in the first stage, under a substantially oxygen-free atmosphere, and until a desired inherent viscosity is obtained.

  本发明涉及一种生产聚苯并咪唑和芳香族酰胺聚合物的两阶段熔融聚合工艺。该工艺包括以下步骤1）提供由芳香胺、二羧酸组分和发泡剂组成的混合物；2）在第一阶段，在基本无氧的气氛下，将混合物加热到缩合聚合温度；3）将混合物保持在该温度，但在任何情况下都不能超过 350℃，同时允许形成易碎泡沫；4) 冷却泡沫； 5) 粉碎泡沫，得到预聚物； 6) 在第二阶段，在基本无氧的环境下，将预聚物加热到超过第一阶段最高温度的温 度，直到获得所需的固有粘度。
• ADHESIVE SHEET FOR SEMICONDUCTOR CONNECTING SUBSTRATE, ADHESIVE-BACKED TAPE FOR TAB, ADHESIVE-BACKED TAPE FOR WIRE-BONDING CONNECTION, SEMICONDUCTOR CONNECTING SUBSTRATE, AND SEMICONDUCTOR DEVICE
  申请人：TORAY INDUSTRIES, INC.

  公开号：EP0823729A1

  公开（公告）日：1998-02-11

  An adhesive sheet for a semiconductor connecting substrate consisting of a laminate having an adhesive layer on a substrate, wherein said adhesive layer contains a thermoplastic resin (A) and an epoxy resin (B) and said epoxy resin (B) contains at least one epoxy resin (B) selected from (I) dicyclopentadiene skeleton-containing epoxy resins, (II) terpene skeleton-containing epoxy resins, (III) biphenyl skeleton-containing epoxy resins and (IV) naphthalene skeleton-containing epoxy resins as an essential component; an adhesive-backed tape for TAB consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 60 to 110°C after having been cured and 50 hours or more in the insulation resistance dropping time after having been allowed to stand in an environment of 130°C and 85% RH with DC 100 V applied; and a tape with adhesive for wire bonding connection consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 120 to 170°C after having been cured, a storage elastic modulus E of 20 to 100 MPa at 150°C and an insulation resistance dropping time of 50 hours or more after having been allowed to stand in an environment of 130°C and 85% RH with DC 100 V applied. The adhesive sheet for a semiconductor connecting substrate, the adhesive-backed tape for TAB and the adhesive-backed tape for wire bonding connection of the present invention are excellent in adhesive strength, insulatability, dimensional accuracy, etc., and can improve the reliability of a semiconductor integrated circuit connecting substrate and a semiconductor device respectively for high density packaging.

  一种用于半导体连接基板的粘合片，包括在基板上具有粘合层的层压板，其中所述粘合层包含热塑性树脂(A)和环氧树脂(B)，并且所述环氧树脂(B)包含至少一种选自(I)含双环戊二烯骨架环氧树脂、(II)含萜烯骨架环氧树脂、(III)含联苯骨架环氧树脂和(IV)含萘骨架环氧树脂的环氧树脂(B)作为基本成分；一种用于 TAB 的背胶胶带，由在柔性有机绝缘薄膜上具有粘合剂层和保护膜层的层压板组成，其中所述粘合剂层在固化后的软化温度为 60 至 110°C，在 130°C 和 85% 相对湿度的环境中放置 50 小时或更长时间后，绝缘电阻下降时间为直流 100 V；一种用于导线粘合连接的带粘合剂的胶带，包括在柔性有机绝缘薄膜上具有粘合剂层和保护膜层的层压板，其中所述粘合剂层在固化后的软化温度为 120 至 170°C，在 150°C 时的存储弹性模量 E 为 20 至 100 兆帕，在 130°C 和 85% 相对湿度的环境中放置 50 小时或更长时间并施加直流 100 伏电压后的绝缘电阻下降时间。本发明的半导体连接基板用粘合片、TAB用背胶胶带和导线键合连接用背胶胶带在粘合强度、绝缘性、尺寸精度等方面都非常出色，可分别提高用于高密度封装的半导体集成电路连接基板和半导体器件的可靠性。
• Adhesive sheet for semiconductor connecting substrate, adhesive-backed tape for TAB, adhesive-backed tape for wire bonding connection, semiconductor connecting substrate, and semiconductor device
  申请人：TORAY INDUSTRIES, INC.

  公开号：EP1447843A2

  公开（公告）日：2004-08-18

  An adhesive sheet for a semiconductor connecting substrate consisting of a laminate having an adhesive layer on a substrate, wherein said adhesive layer contains a thermoplastic resin (A) and an epoxy resin (B) and said epoxy resin (B) contains at least one epoxy resin (B) selected from (I) dicyclopentadiene skeleton-containing epoxy resins, (II) terpene skeleton-containing epoxy resins, (III) biphenyl skeleton-containing epoxy resins and (IV) naphthalene skeleton-containing epoxy resins as an essential component; an adhesive-backed tape for TAB consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 60 to 110°C after having been cured and 50 hours or more in the insulation resistance dropping time after having been allowed to stand in an environment of 130°C and 85% RH with DC 100 V applied; and a tape with adhesive for wire bonding connection consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 120 to 170°C after having been cured, a storage elastic modulus E' of 20 to 100 MPa at 150°C and an insulation resistance dropping time of 50 hours or more after having been allowed to stand in an environment of 130°C and 85 % RH with DC 100 V applied. The adhesive sheet for a semiconductor connecting substrate, the adhesive-backed tape for TAB and the adhesive-backed tape for wire bonding connection of the present invention are excellent in adhesive strength, insulatability, dimensional accuracy, etc., and can improve the reliability of a semiconductor integrated circuit connecting substrate and a semiconductor device respectively for high density packaging.

  一种用于半导体连接基板的粘合片，包括在基板上具有粘合层的层压板，其中所述粘合层包含热塑性树脂(A)和环氧树脂(B)，并且所述环氧树脂(B)包含至少一种选自(I)含双环戊二烯骨架环氧树脂、(II)含萜烯骨架环氧树脂、(III)含联苯骨架环氧树脂和(IV)含萘骨架环氧树脂的环氧树脂(B)作为基本成分；一种用于 TAB 的背胶胶带，由在柔性有机绝缘薄膜上具有粘合剂层和保护膜层的层压板组成，其中所述粘合剂层在固化后的软化温度为 60 至 110°C，在 130°C 和 85% 相对湿度的环境中放置 50 小时或更长时间后，绝缘电阻下降时间为直流 100 V；一种用于导线粘合连接的带粘合剂的胶带，由在柔性有机绝缘薄膜上具有粘合剂层和保护膜层的层压板组成，其中所述粘合剂层在固化后的软化温度为 120 至 170°C，在 150°C 时的存储弹性模量 E' 为 20 至 100 兆帕，在 130°C 和 85 % 相对湿度的环境中放置 50 小时或更长时间并施加直流 100 V 后绝缘电阻下降。本发明的半导体连接基板用胶片、TAB 用背胶胶带和导线键合连接用背胶胶带在粘合强度、绝缘性、尺寸精度等方面都非常出色，可分别提高用于高密度封装的半导体集成电路连接基板和半导体器件的可靠性。
• ADHESIVE COMPOSITION FOR SEMICONDUCTOR DEVICE AND COVER LAY FILM, ADHESIVE SHEET, AND COPPER-CLAD POLYIMIDE FILM EACH MADE WITH THE SAME
  申请人：TORAY INDUSTRIES, INC.

  公开号：EP1640428A1

  公开（公告）日：2006-03-29

  An adhesive composition for semiconductor devices which comprises an epoxy resin, a phenoxy resin, and a hardener, wherein part or all of the epoxy resin comprises at least one type of epoxy resin selected from the followings: (a) a dimer acid modified epoxy resin (b) a phosphorus containing epoxy resin having an epoxy equivalent of 2000 to 6000. Said adhesive composition has satisfactory flexural properties even in a high-temperature environment while retaining an excellent toughness of the adhesive and is excellent in soldering heat resistance, adhesive property, flame retardancy and electrical properties. The adhesive composition can suitable be used for cover lay films, adhesive sheets and copper-clad polyimide films.

  一种用于半导体器件的粘合剂组合物，它由环氧树脂、苯氧树脂和固化剂组成，其中部分或全部环氧树脂由至少一种选自以下的环氧树脂组成： (a) 二聚酸改性环氧树脂 (b) 环氧当量为 2000 至 6000 的含磷环氧树脂。 所述粘合剂组合物即使在高温环境下也具有令人满意的挠曲性能，同时还能保持粘合剂的出色韧性，并具有出色的耐焊接热性、粘合性、阻燃性和电气性能。该粘合剂组合物适合用于覆盖层薄膜、粘合片和覆铜聚酰亚胺薄膜。
• ADHESIVE COMPOSITION FOR ELECTRONIC COMPONENTS AND ADHESIVE SHEET FOR ELECTRONIC COMPONENTS USING THE SAME
  申请人：Toray Industries, Inc.

  公开号：EP2192167A1

  公开（公告）日：2010-06-02

  In order to provide an adhesive composition for electronic components that is excellent in adhesion durability under long-term high temperature conditions, thermal cyclability, and insulation reliability, designed is an adhesive composition for electronic components containing a thermoplastic resin (a), an epoxy resin (b), a hardener (c), and an organopolysiloxane (d), wherein the glass transition temperature (Tg) after curing is -10°C to 50°C and the rate of change of Tg after heat-treating the composition at 175°C for 1000 hours is 15% or less.

  为了提供一种电子元件用粘合剂组合物，该组合物在长期高温条件下具有优异的粘合耐久性、热循环性和绝缘可靠性，设计了一种电子元件用粘合剂组合物，该组合物含有热塑性树脂（a）、环氧树脂（b）、固化剂（c）和有机聚硅氧烷（d），其中固化后的玻璃化转变温度（Tg）为-10°C 至 50°C，在 175°C 下热处理 1000 小时后的 Tg 变化率为 15%或以下。