Pentafluorobenzoic acid, 2-methylpropyl ester

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: Pentafluorobenzoic acid, 2-methylpropyl ester
• 英文别名: 2-methylpropyl 2,3,4,5,6-pentafluorobenzoate
• 化学式: C₁₁H₉F₅O₂
• 分子量: 268.18
• InChiKey: GMHPDOIFTMMNHG-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.6
• 重原子数：
  18
• 可旋转键数：
  4
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.36
• 拓扑面积：
  26.3
• 氢给体数：
  0
• 氢受体数：
  7

文献信息

• TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYIMIDE PRECURSOR POLYMER AND METHOD FOR PRODUCING THE SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM
  申请人：SHIN-ETSU CHEMICAL CO., LTD.

  公开号：US20180024434A1

  公开（公告）日：2018-01-25

  The present invention provides a tetracarboxylic acid diester compound shown by the following general formula (1), wherein X 1 represents a tetravalent organic group; and R 1 represents a group shown by the following general formula (2), Y 1  n Rf) k (2) wherein the dotted line represents a bond; Y 1 represents an organic group with a valency of k+1; Rf represents a linear, branched, or cyclic alkyl group having 1 to 20 carbon atoms or an aromatic group in which a part or all of hydrogen atoms is/are substituted with a fluorine atom(s); “k” represents 1, 2, or 3; and “n” represents 0 or 1. There can be provided a tetracarboxylic acid diester compound that can give a polyimide precursor polymer soluble in a safe organic solvent widely used as a solvent of a composition, and usable as a base resin of a negative photosensitive resin composition.
• POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD OF FORMING CURED FILM, INTERLAYER INSULATION FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT
  申请人：SHIN-ETSU CHEMICAL CO., LTD.

  公开号：US20200326624A1

  公开（公告）日：2020-10-15

  The present invention is a positive photosensitive resin composition comprising: (A-1) an alkali-soluble resin containing at least one or more structures selected from a polyimide structure, a polybenzoxazole structure, a polyamide-imide structure, and a precursor structure thereof; (A-2) a resin containing at least one or more structures selected from a polyimide structure, a polybenzoxazole structure, a polyamide-imide structure, and a precursor structure thereof, each of which has no alkali-soluble group and contains a heterocyclic skeleton having at least one or more nitrogen atoms at a molecular end; (B) a compound having a quinonediazide structure for serving as a photosensitizer to generate an acid by light and increase a dissolution speed to an alkaline aqueous solution; and (D) a solvent. This provides a positive photosensitive resin composition which is soluble in an alkaline aqueous solution, can form a fine pattern and can obtain high resolution, and has excellent mechanical characteristics even when cured at low temperatures.