Bis-(3,4-dimethylbenzyl)sulfon | 34277-83-3

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: Bis-(3,4-dimethylbenzyl)sulfon
• 英文别名: Bis[3,4-dimethylbenzyl]sulfone；4-[(3,4-dimethylphenyl)methylsulfonylmethyl]-1,2-dimethylbenzene
• CAS: 34277-83-3
• 化学式: C₁₈H₂₂O₂S
• 分子量: 302.437
• InChiKey: MFEDSGWROYASKV-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  4
• 重原子数：
  21
• 可旋转键数：
  4
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.33
• 拓扑面积：
  42.5
• 氢给体数：
  0
• 氢受体数：
  2

文献信息

• Photosensitive resin composition, photosensitive resin laminate, and pattern forming process
  申请人：Shin-Etsu Chemical Co., Ltd.

  公开号：US11294283B2

  公开（公告）日：2022-04-05

  A photosensitive resin composition is provided comprising 100 pbw of a polyimide silicone containing a primary alcoholic hydroxyl group, a crosslinker, a photoacid generator, a polyfunctional epoxy compound, 1-70 pbw of a filler having an average particle size of 0.01-20.0 μm, and 0.01-30 pbw of a colorant. The resin composition is colored and photosensitive and cures into a product having an improved modulus.

  本发明提供了一种光敏树脂组合物，其中包括 100 pbw 含伯醇羟基的聚酰亚胺硅氧烷、交联剂、光酸发生器、多官能环氧化合物、1-70 pbw 平均粒径为 0.01-20.0 μm 的填料和 0.01-30 pbw 着色剂。该树脂组合物具有着色和光敏性，固化后的产品具有更好的模量。
• Photosensitive resin composition and photosensitive dry film
  申请人：Shin-Etsu Chemical Co., Ltd.

  公开号：US11518876B2

  公开（公告）日：2022-12-06

  A photosensitive resin composition is provided comprising (A) 100 pbw of a phenolic hydroxyl group-containing resin, and (B) 0.1-18 pbw of an epoxy additive in the form of a compound containing 1-8 epoxy groups per molecule, containing nitrogen, sulfur or phosphorus, and having a molecular weight of 50-6,000. The composition has an improved bonding force to metal wirings.

  本发明提供了一种光敏树脂组合物，该组合物包括：(A) 100 pbw 的含羟基酚醛树脂；(B) 0.1-18 pbw 的环氧添加剂，环氧添加剂的形式为每分子含 1-8 个环氧基团的化合物，含氮、硫或磷，分子量为 50-6,000。该组合物对金属线的粘合力有所改善。
• PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE DRY FILM
  申请人：Shin-Etsu Chemical Co., Ltd.

  公开号：US20200140678A1

  公开（公告）日：2020-05-07

  A photosensitive resin composition is provided comprising (A) 100 pbw of a phenolic hydroxyl group-containing resin, and (B) 0.1-18 pbw of an epoxy additive in the form of a compound containing 1-8 epoxy groups per molecule, containing nitrogen, sulfur or phosphorus, and having a molecular weight of 50-6,000. The composition has an improved bonding force to metal wirings.