1,4-Bis[alpha-methoxyethyl]benzene

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 1,4-Bis[alpha-methoxyethyl]benzene
• 英文别名: 1,4-bis(1-methoxyethyl)benzene
• 化学式: C₁₂H₁₈O₂
• 分子量: 194.27
• InChiKey: SLEFGCTURQPRGC-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2
• 重原子数：
  14
• 可旋转键数：
  4
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.5
• 拓扑面积：
  18.5
• 氢给体数：
  0
• 氢受体数：
  2

文献信息

• EPOXY RESIN COMPOSITION, PRODUCTS OF CURING THEREOF, MATERIAL FOR THE ENCAPSULATION OF SEMICONDUCTORS, NOVEL PHENOL RESIN, NOVEL EPOXY RESIN, PROCESS FOR PRODUCTION OF NOVEL PHENOL RESIN AND PROCESS FOR PRODUCTION OF NOVEL EPOXY RESIN
  申请人：DAINIPPON INK AND CHEMICALS, INC.

  公开号：EP1785441A1

  公开（公告）日：2007-05-16

  An epoxy resin composition including an epoxy resin and a curing agent as essential components, in which the curing agent comprises a phenol resin which has each structural moiety of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P), an alkoxy group-containing aromatic hydrocarbon group (B) and a divalent aralkyl group (X), and also has, in a molecular structure, a structure in which the phenolic hydroxyl group-containing aromatic hydrocarbon group (P) and the alkoxy group-containing aromatic hydrocarbon group (B) are bonded with the other phenolic hydroxyl group-containing aromatic hydrocarbon group (P) or alkoxy group-containing aromatic hydrocarbon group (B) via the divalent aralkyl group (X).

  一种环氧树脂组合物，包括作为基本成分的环氧树脂和固化剂，其中固化剂包括酚醛树脂，该酚醛树脂具有含酚羟基的芳香烃基团（P）、含烷氧基的芳香烃基团（B）和二价芳烷基（X）的每个结构分子，并且还具有以下特征在分子结构中，含酚羟基的芳香烃基团（P）和含烷氧基的芳香烃基团（B）通过二价芳烷基（X）与另一个含酚羟基的芳香烃基团（P）或含烷氧基的芳香烃基团（B）键合的结构。
• CURABLE RESIN COMPOSITION, SUBSTANCE RESULTING FROM CURING SAME, PHENOL RESIN, EPOXY RESIN, AND SEMICONDUCTOR SEALING MATERIAL
  申请人：DIC Corporation

  公开号：EP2623535A1

  公开（公告）日：2013-08-07

  A high degree of resistance to moisture and solder and high flame retardancy are realized without incorporating a halogen in view of environmental friendliness. A phenolic resin has structural moieties which are a naphthylmethyloxy group- or anthrylmethyloxy group-containing aromatic hydrocarbon group (ph1), a phenolic hydroxyl group-containing aromatic hydrocarbon group (ph2), and a divalent aralkyl group (X) represented by general formula (1) below: (where Ar represents a phenylene group or a biphenylene group and Rs each independently represent a hydrogen atom or a methyl group) and has a structure in which plural aromatic hydrocarbon groups selected from the group consisting of the naphthylmethyloxy group- or anthrylmethyloxy group-containing aromatic hydrocarbon group (ph1) and the phenolic hydroxyl group-containing aromatic hydrocarbon group (ph2) are bonded through the divalent aralkyl group (X). This phenolic resin is used as a curing agent for an epoxy resin.

  考虑到环境友好性，在不加入卤素的情况下，实现了高防潮性、高耐焊性和高阻燃性。酚醛树脂的结构分子是由以下通式（1）表示的含萘甲氧基或蒽甲氧基的芳香烃基（ph1）、含酚羟基的芳香烃基（ph2）和二价芳烷基（X）： (其中 Ar 代表亚苯基或联苯基，Rs 各自独立地代表氢原子或甲基），其结构是多个芳香烃基团通过二价芳烷基（X）结合在一起，这些芳香烃基团选自含萘甲氧基或蒽甲氧基的芳香烃基团（ph1）和含酚羟基的芳香烃基团（ph2）组成的组。这种酚醛树脂可用作环氧树脂的固化剂。
• Epoxy Resin Composition,Cured Article Thereof, Semiconductor Sealing Material, Novel Phenol Resin, Novel Epoxy Resin,Method for Producing Novel Phenol Resin, And Method For Producing Novel Epoxy Resin
  申请人：Ogura Ichiro

  公开号：US20080255315A1

  公开（公告）日：2008-10-16

  An epoxy resin composition including an epoxy resin and a curing agent as essential components, in which the curing agent comprises a phenol resin which has each structural moiety of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P), an alkoxy group-containing aromatic hydrocarbon group (B) and a divalent aralkyl group (X), and also has, in a molecular structure, a structure in which the phenolic hydroxyl group-containing aromatic hydrocarbon group (P) and the alkoxy group-containing aromatic hydrocarbon group (B) are bonded with the other phenolic hydroxyl group-containing aromatic hydrocarbon group (P) or alkoxy group-containing aromatic hydrocarbon group (B) via the divalent aralkyl group (X).
• EPOXY RESIN COMPOSITION, CURED ARTICLE THEREOF, SEMICONDUCTOR SEALING MATERIAL, NOVEL PHENOL RESIN, NOVEL EPOXY RESIN, METHOD FOR PRODUCING NOVEL PHENOL RESIN, AND METHOD FOR PRODUCING NOVEL EPOXY RESIN
  申请人：Ogura Ichiro

  公开号：US20110275739A1

  公开（公告）日：2011-11-10

  An epoxy resin composition including an epoxy resin and a curing agent as essential components, in which the curing agent comprises a phenol resin which has each structural moiety of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P), an alkoxy group-containing aromatic hydrocarbon group (B) and a divalent aralkyl group (X), and also has, in a molecular structure, a structure in which the phenolic hydroxyl group-containing aromatic hydrocarbon group (P) and the alkoxy group-containing aromatic hydrocarbon group (B) are bonded with the other phenolic hydroxyl group-containing aromatic hydrocarbon group (P) or alkoxy group-containing aromatic hydrocarbon group (B) via the divalent aralkyl group (X).
• CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, PHENOLIC RESIN, EPOXY RESIN, AND SEMICONDUCTOR SEALING MATERIAL
  申请人：Ogura Ichirou

  公开号：US20130237639A1

  公开（公告）日：2013-09-12

  A high degree of resistance to moisture and solder and high flame retardancy are realized without incorporating a halogen in view of environmental friendliness. A phenolic resin has structural moieties which are a naphthylmethyloxy group- or anthrylmethyloxy group-containing aromatic hydrocarbon group (ph1), a phenolic hydroxyl group-containing aromatic hydrocarbon group (ph2), and a divalent aralkyl group (X) represented by general formula (1) below: (where Ar represents a phenylene group or a biphenylene group and Rs each independently represent a hydrogen atom or a methyl group) and has a structure in which plural aromatic hydrocarbon groups selected from the group consisting of the naphthylmethyloxy group- or anthrylmethyloxy group-containing aromatic hydrocarbon group (ph1) and the phenolic hydroxyl group-containing aromatic hydrocarbon group (ph2) are bonded through the divalent aralkyl group (X). This phenolic resin is used as a curing agent for an epoxy resin.