Photosensitive polymer composition, method for forming relief patterns, and electronic parts
申请人:——
公开号:US20010031419A1
公开(公告)日:2001-10-18
A positive-type, heat-resistant photosensitive polymer composition comprising (a) a polyimide precursor or a polyimide which is soluble in an aqueous alkaline solution, (b) a compound capable of generating an acid when exposed to light, and (c) a compound having a phenolic hydroxyl group; a method of forming a relief pattern comprising a step of applying the composition onto a substrate and drying it thereon, a step of exposing it, a step of developing it, and a step of heating it; and an electronic part having as a surface-protecting film or an interlayer insulating film.
一种正型、耐热、光敏聚合物组合物,包括(a)聚酰亚胺前体或可溶于水性碱性溶液的聚酰亚胺,(b)一种能在光照下产生酸的化合物,以及(c)一种具有酚羟基的化合物;一种形成浮雕图案的方法,包括将该组合物涂覆在基板上并在其上干燥,曝光,显影和加热的步骤;以及作为表面保护膜或层间绝缘膜的电子部件。