2,5-Bis-(1',1'-dimethylbutyl)-hydrochinon | 57246-09-0

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 2,5-Bis-(1',1'-dimethylbutyl)-hydrochinon
• 英文别名: 2,5-bis-(1',1'-dimethylbutyl)hydroquinone；2,5-Bis(1,1-dimethylbutyl)hydroquinone；2,5-bis(2-methylpentan-2-yl)benzene-1,4-diol
• CAS: 57246-09-0
• 化学式: C₁₈H₃₀O₂
• 分子量: 278.435
• InChiKey: ZHUWKKIRCLKYNJ-UHFFFAOYSA-N

物化性质

• 熔点：
  122 °C
• 沸点：
  393.9±37.0 °C(Predicted)
• 密度：
  0.974±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  6.7
• 重原子数：
  20
• 可旋转键数：
  6
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.67
• 拓扑面积：
  40.5
• 氢给体数：
  2
• 氢受体数：
  2

文献信息

• OPTICAL DISC AND ULTRAVIOLET-CURABLE COMPOSITION FOR OPTICAL DISC
  申请人：Ito Daisuke

  公开号：US20090207723A1

  公开（公告）日：2009-08-20

  An optical disc of the present invention includes at least a light reflection layer and a light transmission layer formed on a substrate, wherein recording and reading are performed by a laser beam through the light transmission layer, the light transmission layer is formed from a cured film of a ultraviolet-curable composition containing an epoxy acrylate resin obtained by reacting a half ester compound (A), which is obtained from a lactone-adduct of a hydroxyalkyl (meth)acrylate (a1) and a dibasic acid anhydride (a2), and an epoxy resin (B), and the film thickness of the light transmission layer is from 50 to 150 μm.

  本发明的光盘包括至少一个光反射层和一个形成在基板上的光透过层，其中通过光透过层进行记录和读取的激光束，光透过层由紫外线可固化组合物的固化膜形成，该紫外线可固化组合物含有通过羟基烷基（甲基）丙烯酸酯（a1）和二元酸酐（a2）的内酯加成物获得的半酯化合物（A）和环氧树脂（B）反应而得到的环氧丙烯酸酯树脂，并且光透过层的膜厚为50至150μm。
• Modified polyepoxy compound, process for producing the compound, and epoxy resin composition
  申请人：SHELL INTERNATIONALE RESEARCH MAATSCHAPPIJ B.V.

  公开号：EP0661322A2

  公开（公告）日：1995-07-05

  A modified polyepoxy compound obtained by etherifying a secondary hydroxyl group of a polyepoxy compound having an alcoholic secondary hydroxyl group, such as a polyepoxy compound obtained by reaction of a bifunctional phenol compound and an epihalohydrin, or a polyepoxy compound obtained by reaction of a bifunctional phenol type epoxy compound and a bifunctional phenol compound, and an epoxy resin composition using the modified polyepoxy compound as the epoxy resin. Further, a modified brominated polyepoxy compound obtained by etherifying a secondary hydroxyl group of a polyepoxy compound having an alcoholic secondary hydroxyl group obtained by reaction of a polyepoxy compound which does not substantially contain a halogen atom and a polyhydric phenol compound having at least one bromine atom directly bonded to an aromatic ring per one molecule, and an epoxy resin composition for semiconductor encapsulation having blended therewith the modified brominated polyepoxy compound as the flame retardant.

  一种改性聚环氧化合物，通过醚化具有醇仲羟基的聚环氧化合物（例如通过双官能团苯酚化合物和表卤醇反应得到的聚环氧化合物，或通过双官能团苯酚型环氧化合物和双官能团苯酚化合物反应得到的聚环氧化合物）的仲羟基而得到，以及使用该改性聚环氧化合物作为环氧树脂的环氧树脂组合物。此外，一种改性溴化聚环氧化合物，它是通过将一种聚环氧化合物的仲羟基醚化而得到的，这种聚环氧化合物具有醇性仲羟基，该醇性仲羟基是由一种基本上不含卤素原子的聚环氧化合物和一种每一个分子中至少有一个溴原子直接键合到一个芳香环上的多羟基酚化合物反应而得到的，还有一种用于半导体封装的环氧树脂组合物，其中掺入了该改性溴化聚环氧化合物作为阻燃剂。
• Acrylic block copolymer and its use and production process
  申请人：Nippon Shokubai Co., Ltd.

  公开号：EP1094086A1

  公开（公告）日：2001-04-25

  The present invention provides an acrylic block copolymer and its use and production process, wherein the acrylic block copolymer exhibits high heat resistance despite having a low viscosity. The acrylic block copolymer comprises a (meth)acrylic ester structural unit as an essential component in a ratio of 50 to 100 weight % of the entirety of the acrylic block copolymer and has a holding power of not less than 100 minutes as specifically determined. This acrylic block copolymer is fit for hot-melt pressure sensitive adhesives. In a production process for this acrylic block copolymer, the second radical polymerization step among the elementary steps of the multistep radical polymerization includes the step of uniformly mixing a polymer solution, resultant from the first radical polymerization step, with a polymerizable monomer which is to be used in the second radical polymerization step.

  本发明提供了一种丙烯酸嵌段共聚物及其用途和生产工艺，其中的丙烯酸嵌段共聚物尽管粘度较低，但具有很高的耐热性。该丙烯酸嵌段共聚物由（甲基）丙烯酸酯结构单元作为基本成分组成，其重量占丙烯酸嵌段共聚物总量的 50%至 100%，具体测定其保持力不低于 100 分钟。这种丙烯酸嵌段共聚物适用于热熔压敏胶。在这种丙烯酸嵌段共聚物的生产工艺中，多步自由基聚合基本步骤中的第二步自由基聚合步骤包括将第一自由基聚合步骤产生的聚合物溶液与第二自由基聚合步骤中使用的可聚合单体均匀混合的步骤。
• PROCESSES FOR PRODUCING THERMOPLASTIC RESINS, CROSSLINKED RESINS AND CROSSLINKED RESIN COMPOSITE MATERIALS
  申请人：ZEON CORPORATION

  公开号：EP1535941A1

  公开（公告）日：2005-06-01

  The invention relates to a process for the production of post-crosslinkable thermoplastic resins by bulk-polymerizing a polymerizable composition (A) comprising (I) a monomer fluid containing a cyclic olefin (α) having two or more metathetical ring-opening reaction sites in the molecule in an amount 10 wt% or above based on the total amount of the monomers or a monomer fluid containing a norbornene monomer and a crosslinking agent, (II) a metathetical polymerization catalyst, and (III) a chain transfer agent; thermoplastic resins obtained by this process; and a process for producing crosslinked resins or crosslinked resin composite materials which comprises laminating such a thermoplastic resin with a substrate at need and then crosslinking the thermoplastic resin. According to the invention, thermoplastic resins which are free from odor due to residual monomers and excellent in storage stability can be efficiently obtained by a simple process of bulk-polymerizing the composition (A). The process is not only easy and simple but also applicable to continuous production, thus being industrially advantageous. The crosslinked resins and crosslinked resin composite materials obtained according to the invention are excellent in electrical insulation properties, mechanical strengths, heat resistance, dielectric characteristics and so on, thus being useful as electrical materials or the like.

  本发明涉及一种通过批量聚合可聚合组合物（A）来生产可后交联热塑性树脂的工艺，该组合物（A）包含（I）单体流体，该单体流体含有分子中具有两个或两个以上元开环反应位点的环烯烃（α），其含量为单体总量的 10 wt%或以上，或含有降冰片烯单体和交联剂的单体流体、(II) 元聚合催化剂，以及 (III) 链转移剂；通过该工艺获得的热塑性树脂；以及生产交联树脂或交联树脂复合材料的工艺，该工艺包括在需要时将这种热塑性树脂与基材层压，然后使热塑性树脂交联。根据本发明，通过组合物（A）的简单批量聚合工艺，可以有效地获得无残留单体气味且储存稳定性极佳的热塑性树脂。该工艺不仅简单易行，而且适用于连续生产，因此具有工业优势。根据本发明获得的交联树脂和交联树脂复合材料具有优异的电绝缘性能、机械强度、耐热性、介电特性等，因此可用作电气材料或类似材料。
• PROCESS FOR PRODUCING CYCLOOLEFIN RESIN FILM AND PROCESS FOR PRODUCING CYCLOOLEFIN POLYMER SHEET OR FILM
  申请人：ZEON CORPORATION

  公开号：EP1589055A1

  公开（公告）日：2005-10-26

  A process (1) for producing a cycloolefin resin film comprising the steps of: the step (I) of mixing a cycloolefin monomer and a metathesis polymerization catalyst to prepare a polymerizable composition (A); the step (II) of coating or impregnating the supporting body with the polymerizable composition (A) at once after the step(I), and the step (III) of polymerizing the polymerizable composition (A) by bulk polymerization; and a process (2) for producing a cycloolefin polymer sheet or film with the thickness of 1 mm or less comprising polymerizing a reactive solution containing a ruthenium complex catalyst, having a hetero atom-containing carbene compound as a ligand, and a cycloolefin monomer by ring-opening metathesis bulk polymerization, wherein the polymerization of the cycloolefin monomer is completed by heating the reactive solution to 100°C or higher at the heating rate of 20°C/min or more. Thus, a cycloolefin resin film having excellent adhesion to other materials and a cycloolefin polymer sheet of film having a thickness of 1 mm or smaller can be efficiently produced.

  一种生产环烯烃树脂薄膜的工艺（1），包括以下步骤：步骤(I)混合环烯烃单体和偏聚催化剂，制备可聚合组合物(A)； 步骤(II)在步骤(I)后立即用可聚合组合物(A)涂覆或浸渍支撑体，以及 步骤(III)通过批量聚合使可聚合组合物(A)聚合；以及一种生产厚度为 1 毫米或以下的环烯烃聚合物片材或薄膜的工艺 (2)，该工艺包括通过开环偏合成批量聚合将含有钌络合物催化剂的反应溶液和环烯烃单体聚合，钌络合物催化剂具有含杂原子的碳烯化合物作为配体，其中环烯烃单体的聚合是通过以 20°C/min 或更高的加热速率将反应溶液加热至 100°C 或更高来完成的。因此，可以有效地生产出与其他材料具有良好粘附性的环烯烃树脂薄膜和厚度为 1 毫米或更小的环烯烃聚合物薄膜片材。