Disclosed are a conductive thienyl derivative monomolecular film covalently bonded to a substrate surface and method of manufacturing the same, and a silicon compound comprising 3-thienyl groups (thiophene derivative) used for forming the conductive monomolecular film and a method of manufacturing the same. A monomolecular ultrathin film comprising 3-thienyl groups and silicon groups is formed in the invention. The silicon compound used for forming the film is provided by reacting ω-(3-thienyl)-1-alkene compound to a monosilane derivative compound, in which three out of four hydrogen atoms of monosilane are replaced with halogen or alkoxy groups, in the presence of a transition metal catalyst. A substrate is dipped and held in a nonaqueous solution of the above-noted compound, thus chemically bonding the monomolecular film to the substrate surface. Furthermore, a thienyl derivative ultrathin film is formed by the electrolytic or catalytic polymerization of the monomolecular film.
本发明公开了一种共价键合到基底表面的导电
噻吩基衍
生物单分子薄膜及其制造方法,以及一种用于形成导电单分子薄膜的包含 3-
噻吩基(
噻吩衍
生物)的
硅化合物及其制造方法。本发明形成了一种由 3-
噻吩基团和
硅基团组成的单分子超薄薄膜。用于形成薄膜的
硅化合物是通过将ω-(3-
噻吩基)-1-烯化合物与单
硅烷衍
生物化合物在过渡
金属催化剂存在下反应而得到的,在单
硅烷衍
生物化合物中,单
硅烷的四个氢原子中有三个被卤素或烷氧基取代。将基底浸泡在上述化合物的非
水溶液中,从而使单分子膜与基底表面发生
化学键合。此外,通过单分子薄膜的电解或催化聚合,形成
噻吩基衍
生物超薄薄膜。