A polyimide resin composition comprising 50-95 parts by weight of a polyimide resin represented by general formula (1) and 50-5 parts by weight of a polyether-etherketone and having an enthalpy of crystallization of 0-6 cal/g after being heat-treated at 250-330 °C, wherein X represents a direct bond, hydrocarbylene, carbonyl, thio, etc.; Y₁ to Y₄ represent each hydrogen, lower alkyl, etc.; and R₁ represents an aliphatic or aromatic group, etc. This composition can be heat-treated at a lower temperature in a shorter time and is excellent in dimensional stability and high-temperature properties and also in moldability and peeling resistance.
一种聚
酰亚胺树脂组合物,由 50-95 份(按重量计)通式(1)代表的聚
酰亚胺树脂和 50-5 份(按重量计)
聚醚醚酮组成,在 250-330 °C 下热处理后的结晶焓为 0-6 卡/克,其中 X 代表直接键、烃基、羰基、
硫基等;Y₁至 Y₄ 各代表氢、低级烷基等;R₁ 代表脂肪族或芳香族基团等。Y₁ 至 Y₄ 分别代表氢、低级烷基等;R₁ 代表脂肪族或芳香族等。这种组合物可以在较短的时间内以较低的温度进行热处理,具有优异的尺寸稳定性和高温性能,以及成型性和抗剥离性。