FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR FORMING FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND PATTERN FORMING METHOD
申请人:Mitsubishi Gas Chemical Company, Inc.
公开号:EP3627224A1
公开(公告)日:2020-03-25
The present invention provides a film forming material for lithography comprising a compound having a group of the following formula (0):
本发明提供了一种用于光刻的成膜材料,它包含一种具有下式(0)基团的化合物: