申请人:AKITA UNIVERSITY
公开号:US10815369B2
公开(公告)日:2020-10-27
The invention provides a composition capable of providing a molded article that has excellent heat resistance and a small weight change against oxygen plasma exposure and fluorine plasma exposure during a semiconductor manufacturing step. The composition contains a fluorine-containing polymer and a hyperbranched polymer of a cage silsesquioxane with a specific structure.
本发明提供了一种组合物,该组合物能够在半导体制造步骤中提供具有优异耐热性和较小重量变化的模制品,使其免受氧等离子体暴露和氟等离子体暴露的影响。该组合物含有一种含氟聚合物和一种具有特定结构的笼状硅倍半氧烷超支化聚合物。