(6-Acetylnaphthalen-2-yl) 4-(3,5-dioxo-4-azatricyclo[5.2.1.02,6]decan-4-yl)benzoate

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: (6-Acetylnaphthalen-2-yl) 4-(3,5-dioxo-4-azatricyclo[5.2.1.02,6]decan-4-yl)benzoate
• 英文别名: (6-acetylnaphthalen-2-yl) 4-(3,5-dioxo-4-azatricyclo[5.2.1.02,6]decan-4-yl)benzoate
• 化学式: C₂₈H₂₃NO₅
• 分子量: 453.5
• InChiKey: REBUKBMJXWFYEC-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  4.8
• 重原子数：
  34
• 可旋转键数：
  5
• 环数：
  6.0
• sp3杂化的碳原子比例：
  0.29
• 拓扑面积：
  80.8
• 氢给体数：
  0
• 氢受体数：
  5

文献信息

• RESIN COMPOSITION FOR INSULATION, INSULATING FILM, PREPREG, AND PRINTED CIRCUIT BOARD.
  申请人：SAMSUNG ELECTRO-MECHANICS CO., LTD.

  公开号：US20140080940A1

  公开（公告）日：2014-03-20

  Disclosed herein are a resin composition for insulation, and an insulating film, a prepreg, and a printed circuit board, manufactured using the same, the resin composition including: a cellulose nanoparticle or a cellulose nanofiber; a liquid crystalline oligomer or a soluble liquid crystalline thermohardenable oligomer; an epoxy resin; and an inorganic filler, so that the resin composition, the insulating film, and the prepreg can have a low coefficient of thermal expansion, a high glass transition temperature, and high rigidity.
• INSULATING COMPOSITION FOR MULTILAYER PRINTED CIRCUIT BOARD, METHOD FOR PREPARING THE SAME, AND MULTILAYER PRINTED CIRCUIT BOARD COMPRISING THE SAME AS INSULATING LAYER
  申请人：SAMSUNG ELECTRO-MECHANICS CO., LTD.

  公开号：US20140080941A1

  公开（公告）日：2014-03-20

  The present invention relates to an insulating composition for a multilayer printed circuit board including: nanoclay 0.5 to 10 wt %, a soluble liquid crystal oligomer 5 to 50 wt %, an epoxy resin 5 to 50 wt %, a solvent 5 to 40 wt %, and an inorganic filler 50 to 80 wt %, a prepreg and an insulating film using the composition, and a multilayer printed circuit board including the prepreg and the insulating film as an interlayer insulating layer. Accordingly, the composition prepared by mixing nanoclay with the soluble liquid crystal oligomer (LCO), the epoxy resin, and the inorganic filler having excellent thermal, electrical, and mechanical characteristics can be implemented as a substrate insulating material such as a prepreg or a film which can implement a low efficient of thermal expansion, high rigidity, and high thermal characteristics required for a package substrate with advanced specifications.
• INSULATING FILM FOR PRINTED CIRCUIT BOARD HAVING IMPROVED THERMAL CONDUCTIVITY, MANUFACTURING METHOD THEREOF, AND PRINTED CIRCUIT BOARD USING THE SAME
  申请人：SAMSUNG ELECTRO-MECHANICS CO., LTD.

  公开号：US20140174792A1

  公开（公告）日：2014-06-26

  This invention relates to an insulating film for a printed circuit board having improved thermal conductivity, a manufacturing method thereof and a printed circuit board using the same, wherein the insulating film includes an amphiphilic block copolymer having a vertical structure formed in a thickness direction by chemically coupling a hydrophilic compound with a hydrophobic compound.
• RESIN COMPOSITION WITH ENHANCED HEAT-RELEASING PROPERTIES, HEAT-RELEASING FILM, INSULATING FILM, AND PREPREG
  申请人：SAMSUNG ELECTRO-MECHANICS CO., LTD.

  公开号：US20140187674A1

  公开（公告）日：2014-07-03

  This invention relates to a resin composition with enhanced heat-releasing properties, including a liquid crystal oligomer, an epoxy resin, or a resin mixture thereof, and graphene oxide as a filler, and to a heat-releasing film for an electronic device, an insulating film for a printed circuit board, and a prepreg, which are manufactured using the resin composition.