1-[2-(4-Dimethylphosphoryloxyphenyl)propan-2-yl]-4-methoxybenzene

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 1-[2-(4-Dimethylphosphoryloxyphenyl)propan-2-yl]-4-methoxybenzene
• 英文别名: 1-[2-(4-dimethylphosphoryloxyphenyl)propan-2-yl]-4-methoxybenzene
• 化学式: C₁₈H₂₃O₃P
• 分子量: 318.3
• InChiKey: PHXRNTXNAOPZCX-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  4
• 重原子数：
  22
• 可旋转键数：
  5
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.33
• 拓扑面积：
  35.5
• 氢给体数：
  0
• 氢受体数：
  3

文献信息

• Thermosetting resin composition and use thereof
  申请人：Shengyi Technology Co., Ltd.

  公开号：US10029438B2

  公开（公告）日：2018-07-24

  The present invention relates to a thermosetting resin composition, which comprises: (A) cyanate ester compound and/or cyanate ester prepolymer; and (B) polyphosphonate ester and/or phosphonate-carbonate copolymer. The thermosetting resin composition provided by the present invention has low dielectric constant and dielectric loss tangent. The prepreg and copper clad laminate made from the above-mentioned thermosetting resin composition have excellent dielectric properties and wet-heat resistance, UL94 V-0 flame resistance, and good processability.

  本发明涉及一种热固性树脂组合物，它包括：(A) 氰酸酯化合物和/或氰酸酯预聚 物；和 (B) 聚膦酸酯和/或膦酸-碳酸酯共聚物。本发明提供的热固性树脂组合物具有较低的介电常数和介电损耗正切。由上述热固性树脂组合物制成的预浸料和覆铜板具有优异的介电性能和耐湿热性、UL94 V-0 阻燃性以及良好的加工性。
• FLAME RETARDANT POLYLACTIC ACID COMPOUNDS
  申请人：Zhu Shixiong

  公开号：US20140080975A1

  公开（公告）日：2014-03-20

  A significant disadvantage of the use of polylactic acid (PLA), lack of flame retardance, has been overcome by the use of polyphosphonate-co-carbonate in combination with an impact modifier, a drip suppressant, and optionally, an epoxy functional styrene-acrylate oligomeric chain extender. The compound achieves a UL 94 rating of V-0 or V-1 and a Notched Izod value of more than about 5 ft-lbs/in. The compound also exceeds a threshold of 100 C in heat deflection temperature.
• THERMOSETTING RESIN COMPOSITION AND USAGE THEREOF
  申请人：Shengyi Technology Co., Ltd.

  公开号：US20150189744A1

  公开（公告）日：2015-07-02

  The present invention relates to a thermosetting resin composition, wherein the resin composition comprises of: (A) epoxy resin; (B) active ester curing agent; (C) poly-phosphonate ester and/or phosphonate-carbonate copolymer. The prepreg and copper clad laminate prepared with the thermosetting resin composition mentioned above has excellent dielectric performance, wet-heat resistance performance, and a flame resistance performance of UL 94 V-0 level.
• THERMOSETTING RESIN COMPOSITION AND USE THEREOF
  申请人：Shengyi Technology Co., Ltd.

  公开号：US20150189747A1

  公开（公告）日：2015-07-02

  The present invention relates to a thermosetting resin composition, which comprises: (A) cyanate ester compound and/or cyanate ester prepolymer; and (B) polyphosphonate ester and/or phosphonate-carbonate copolymer. The thermosetting resin composition provided by the present invention has low dielectric constant and dielectric loss tangent. The prepreg and copper clad laminate made from the above-mentioned thermosetting resin composition have excellent dielectric properties and wet-heat resistance, UL94 V-0 flame resistance, and good processability.
• COMPLETELY NON-HALOGENATED FLAME RETARDANT POLYCARBONATE COMPOUNDS
  申请人：POLYONE CORPORATION

  公开号：US20160122534A1

  公开（公告）日：2016-05-05

  A completely non-halogenated flame retardant polycarbonate compound is disclosed. The compound comprises a polycarbonate, non-halogenated drip suppressant ingredients which react in the presence of heat to form a drip suppressant adduct, and a non-halogenated char former. The compound can achieve a UL 94 rating of V-0 at a thickness of at least 3.2 mm and otherwise achieves no dripping/igniting of the cotton indicator during that test.