2-[(5-sulfanylidene-2H-1,2,4-thiadiazol-3-yl)sulfanyl]butanedioic acid

• 分子结构分类: 有机化合物 - 有机硫化合物 - 硫醚类
• 英文名称: 2-[(5-sulfanylidene-2H-1,2,4-thiadiazol-3-yl)sulfanyl]butanedioic acid
• 化学式: C₆H₆N₂O₄S₃
• 分子量: 266.3
• InChiKey: JAVZMKVRGOVVAD-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  0.6
• 重原子数：
  15
• 可旋转键数：
  5
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.33
• 拓扑面积：
  182
• 氢给体数：
  3
• 氢受体数：
  7

文献信息

• RESIN COMPOSITION AND SEMICONDUCTOR DEVICE BOARD
  申请人：Osaku Yumi

  公开号：US20140087136A1

  公开（公告）日：2014-03-27

  A resin composition which contains a binder resin (A), radiation-sensitive compound (B), silane-modified resin (C), and antioxidant (D), wherein a content of the silane-modified resin (C) is 0.1 to 150 parts by weight with respect to 100 parts by weight of the binder resin (A), a content of the antioxidant (D) is 0.1 to 10 parts by weight with respect to 100 parts by weight of the binder resin (A), and an amount of warping is 14 μm or less when using the resin composition to form a thickness 2 to 3 μm resin film and baking the formed resin film at 230° C. is provided.

  一种树脂组合物，包含粘合剂树脂（A），辐射敏感化合物（B），硅改性树脂（C）和抗氧化剂（D），其中硅改性树脂（C）的含量相对于100份粘合剂树脂（A）为0.1至150份重量，抗氧化剂（D）的含量相对于100份粘合剂树脂（A）为0.1至10份重量，并且使用该树脂组合物形成2至3μm厚度的树脂膜并在230°C下烘烤形成的树脂膜翘曲量为14μm或以下。
• RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC COMPONENT
  申请人：Zeon Corporation

  公开号：EP3434731A1

  公开（公告）日：2019-01-30

  A resin composition comprising a cyclic olefin polymer (A) having a protonic polar group, a cross-linking agent (B), and an organic solvent (C), wherein the organic solvent (C) contains diethylene glycol ethyl methyl ether, and a content of diethylene glycol dimethyl ether contained in the organic solvent (C) is 10 ppm by weight or less when a content of the diethylene glycol ethyl methyl ether is 100 wt%, is provided.

  本发明提供了一种树脂组合物，该树脂组合物由具有质子极性基团的环烯烃聚合物（A）、交联剂（B）和有机溶剂（C）组成，其中有机溶剂（C）含有二乙二醇乙基甲基醚，当二乙二醇乙基甲基醚的含量为 100 wt%时，有机溶剂（C）中所含的二乙二醇二甲醚的含量为 10 ppm 或以下（按重量计）。
• Resin composition, resin film, and electronic device
  申请人：ZEON CORPORATION

  公开号：US10151977B2

  公开（公告）日：2018-12-11

  A resin composition comprising a binder resin (A), a compound (B) having an acidic group or latent acidic group, an organic solvent (C), and a compound (D) having one atom selected from a silicon atom, titanium atom, aluminum atom, and zirconium atom and having a hydrocarbyloxy group or hydroxy group bonded with that atom, wherein the compound (B) is at least one type selected from the group consisting of an aliphatic compound, aromatic compound, and heterocyclic compound, and a content of the compound (B) is 0.1 to 2.5 parts by weight and a content of the compound (D) is 2.2 to 7.0 parts by weight with respect to 100 parts by weight of the binder resin (A) is provided.

  一种树脂组合物，包括粘合剂树脂 (A)、具有酸性基团或潜在酸性基团的化合物 (B)、有机溶剂 (C) 和具有一个从硅原子、钛原子、铝原子和锆原子中选出的原子并具有与该原子结合的烃基或羟基的化合物 (D)，其中化合物 (B) 至少是一种从脂肪族化合物、芳香族化合物和杂环化合物组成的组中选出的类型，化合物 (B) 的含量为 0.1 至 2.5 份（重量），化合物 (D) 的含量为 2.2 至 7.0 份（重量）（相对于 100 份（重量）粘合剂树脂 (A)）。以 100 份粘结剂树脂（A）的重量计，化合物（D）的含量为 2.2 至 7.0 份。
• RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE
  申请人：Zeon Corporation

  公开号：EP3434731B1

  公开（公告）日：2021-06-09
• NEGATIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE
  申请人：Tanabe Akihiro

  公开号：US20140154627A1

  公开（公告）日：2014-06-05

  A negative type photosensitive resin composition containing a resin compound (A) which has a weight average molecular weight of 1000 or more, a (meth)acryloyl compound (B), a silane-modified resin (C), a radical-generating type photopolymerization initiator (D), and a silicon atom-free epoxy group-containing cross-linking agent (E), wherein the resin compound (A) contains a resin compound (A1) which has two or more (meth)acryloyl groups in a molecule and which has a carboxyl group which reacts with the epoxy group and the (meth)acryloyl compound (B) has a weight average molecular weight of less than 1000 and has two or more (meth)acryloyl groups in a molecule, is provided.