4-[(3-Sulfanylidene-1,2,4-thiadiazol-5-yl)sulfanyl]butane-1-sulfonic acid

• 分子结构分类: 有机化合物 - 有机硫化合物 - 硫醚类
• 英文名称: 4-[(3-Sulfanylidene-1,2,4-thiadiazol-5-yl)sulfanyl]butane-1-sulfonic acid
• 英文别名: 4-[(3-sulfanylidene-1,2,4-thiadiazol-5-yl)sulfanyl]butane-1-sulfonic acid
• 化学式: C₆H₁₀N₂O₃S₄
• 分子量: 286.4
• InChiKey: APEJSILROGJBIS-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1
• 重原子数：
  15
• 可旋转键数：
  6
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.67
• 拓扑面积：
  170
• 氢给体数：
  2
• 氢受体数：
  6

文献信息

• RESIN COMPOSITION AND SEMICONDUCTOR DEVICE BOARD
  申请人：Osaku Yumi

  公开号：US20140087136A1

  公开（公告）日：2014-03-27

  A resin composition which contains a binder resin (A), radiation-sensitive compound (B), silane-modified resin (C), and antioxidant (D), wherein a content of the silane-modified resin (C) is 0.1 to 150 parts by weight with respect to 100 parts by weight of the binder resin (A), a content of the antioxidant (D) is 0.1 to 10 parts by weight with respect to 100 parts by weight of the binder resin (A), and an amount of warping is 14 μm or less when using the resin composition to form a thickness 2 to 3 μm resin film and baking the formed resin film at 230° C. is provided.

  一种树脂组合物，包含粘合剂树脂（A），辐射敏感化合物（B），硅改性树脂（C）和抗氧化剂（D），其中硅改性树脂（C）的含量相对于100份粘合剂树脂（A）为0.1至150份重量，抗氧化剂（D）的含量相对于100份粘合剂树脂（A）为0.1至10份重量，并且使用该树脂组合物形成2至3μm厚度的树脂膜并在230°C下烘烤形成的树脂膜翘曲量为14μm或以下。
• NEGATIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE
  申请人：Tanabe Akihiro

  公开号：US20140154627A1

  公开（公告）日：2014-06-05

  A negative type photosensitive resin composition containing a resin compound (A) which has a weight average molecular weight of 1000 or more, a (meth)acryloyl compound (B), a silane-modified resin (C), a radical-generating type photopolymerization initiator (D), and a silicon atom-free epoxy group-containing cross-linking agent (E), wherein the resin compound (A) contains a resin compound (A1) which has two or more (meth)acryloyl groups in a molecule and which has a carboxyl group which reacts with the epoxy group and the (meth)acryloyl compound (B) has a weight average molecular weight of less than 1000 and has two or more (meth)acryloyl groups in a molecule, is provided.
• RESIN COMPOSITION AND GATE INSULATING FILM
  申请人：ZEON CORPORATION

  公开号：US20160160012A1

  公开（公告）日：2016-06-09

  A resin composition containing a resin (A) which contains a hydroxyl group and a cyanoalkyl group, an epoxy compound (B) which has two or more epoxy groups in its molecule, a curing agent (C) which has two or more hydroxyl groups in its molecule and has a hydroxyl value of 150 to 300 mgKOH/g, and a cross-linking agent (D) which has a structure represented by the general formula (1). (In the general formula (1), R 1 and R 2 are C 1 to C 20 alkyl groups, where R 1 and R 2 may be the same as each other or different from each other.)
• US9617408B2
  申请人：——

  公开号：US9617408B2

  公开（公告）日：2017-04-11