1,1'-Biphenyl;naphthalen-1-ol

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 1,1'-Biphenyl;naphthalen-1-ol
• 英文别名: 1,1'-biphenyl;naphthalen-1-ol
• 化学式: C22H18O
• 分子量: 298.4
• InChiKey: RBYYWIBJLYXSKN-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  5.9
• 重原子数：
  23
• 可旋转键数：
  1
• 环数：
  4.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  20.2
• 氢给体数：
  1
• 氢受体数：
  1

文献信息

• Cyanate Ester Resin Composition, and a Prepreg, a Laminated Material and a Metal Clad Laminated Material Made Therefrom
  申请人：Shengyi Technology Co., Ltd.

  公开号：EP2722363A1

  公开（公告）日：2014-04-23

  The present invention relates to a cyanate ester resin composition and a prepreg, a laminated material and a metal clad laminated material made therefrom. The cyanate ester resin composition comprises cyanate ester resin, non-halogen epoxy resin, and inorganic filler material, and the structural formula of the cyanate ester resin is as the following: wherein, R and R1 represent hydrogen, alkyl, aryl or aralkyl, and n represents an integer between 1 and 50. The cyanate ester resin composition of the present invention has good mechanical properties, heat resistance and flame retardance. The laminated material and the metal clad laminated material made from the prepreg that is made from the cyanate ester resin composition, still have good flame retardance, low coefficients of thermal expansion in X, Y directions, and good mechanical properties, without using halogen-containing compounds or phosphorus-containing compounds as the flame retardant.

  本发明涉及一种氰酸酯树脂组合物及其制成的预浸料、层压材料和金属覆层材料。氰酸酯树脂组合物包括氰酸酯树脂、无卤环氧树脂和无机填充材料，氰酸酯树脂的结构式如下： 其中，R 和 R1 代表氢、烷基、芳基或芳烷基，n 代表 1 至 50 之间的整数。 本发明的氰酸酯树脂组合物具有良好的机械性能、耐热性和阻燃性。在不使用含卤化合物或含磷化合物作为阻燃剂的情况下，由氰酸酯树脂组合物制成的预浸料制成的层压材料和金属铠装层压材料仍具有良好的阻燃性、较低的 X、Y 方向热膨胀系数和良好的机械性能。
• HEAT-CURABLE MALEIMIDE RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
  申请人：Shin-Etsu Chemical Co., Ltd.

  公开号：US20210024749A1

  公开（公告）日：2021-01-28

  Provided is a heat-curable maleimide resin composition capable of being turned into a cured product with a superior dielectric property, and allowing a plating layer(s) to be formed only at laser-irradiated parts on the surface of or inside the cured product. The heat-curable maleimide resin composition contains: (A) a cyclic imide compound having, in one molecule, at least one dimer acid backbone, at least one linear alkylene group having not less than 6 carbon atoms, and at least two cyclic imide groups; and (B) a laser direct structuring additive being a metal oxide having a spinel structure and represented by the following average composition formula (1): AB 2 O 4 (1) wherein A represents one or more metal elements selected from iron, copper, nickel, cobalt, zinc, magnesium and manganese, B represents iron or chrome, provided that A and B do not both represent iron.