5-(2,6-Dimethylphenoxy)-2-[4-[(4-ethenylphenyl)methoxy]-3,5-dimethylphenoxy]-1,3-dimethylbenzene

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 5-(2,6-Dimethylphenoxy)-2-[4-[(4-ethenylphenyl)methoxy]-3,5-dimethylphenoxy]-1,3-dimethylbenzene
• 英文别名: 5-(2,6-dimethylphenoxy)-2-[4-[(4-ethenylphenyl)methoxy]-3,5-dimethylphenoxy]-1,3-dimethylbenzene
• 化学式: C₃₃H₃₄O₃
• 分子量: 478.6
• InChiKey: CHNCEQQOEOANLQ-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  9.4
• 重原子数：
  36
• 可旋转键数：
  8
• 环数：
  4.0
• sp3杂化的碳原子比例：
  0.21
• 拓扑面积：
  27.7
• 氢给体数：
  0
• 氢受体数：
  3

文献信息

• HALOGEN-FREE RESIN COMPOSITION AND APPLICATION THEREOF
  申请人：ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD

  公开号：US20140113118A1

  公开（公告）日：2014-04-24

  A halogen-free resin composition including (A) 100 parts by weight of polyphenylene ether resin containing an alkenyl group; (B) 10 to 50 parts by weight of cyclo olefin copolymer (COC); (C) 5 to 50 parts by weight of 1,2,4-trivinylcyclohexane resin and/or 1,3,5-triethyloxymethyl cyclohexane resin; and (D) 5 to 150 parts by weight of polyphenylene ether pre-polymerized branch cyanate ester. The halogen-free resin composition can manifest low dielectric constant, low dielectric dissipation factor, high heat resistance, and high glass transition temperature by using the specified ingredient in the specified ratio, thus can be used in preparing a prepreg or a resin film, which is applicable to copper clad laminates and printed circuit boards.
• HIGH DIELECTRIC BREAKDOWN STRENGTH RESINS
  申请人：LOMBARDI JOHN L.

  公开号：US20180009934A1

  公开（公告）日：2018-01-11

  A method to prepare an oligomer which includes a plurality of pendent alkenyl groups, where the method reacts a copolymer formed by copolymerizing styrene and allyl alcohol comprising a polyhydroxy oligomer wherein n is between about 3 and about 50, and having a structure: with an isocyanate having a structure: to give a urethane-modified copolymer having a structure: