申请人:Hamada Mitsuyoshi
公开号:US20140128505A1
公开(公告)日:2014-05-08
An epoxy resin molding material for sealing includes (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, (E1) an arylamino group-containing alkoxysilane compound, and (E2) an epoxy group-containing alkoxy silane compound.