4-(3,5-dioxo-4-azatricyclo[5.2.1.02,6]decan-4-yl)-N-[4-[2-[3-[2-[4-ethoxy-2-(6-oxobenzo[c][2,1]benzoxaphosphinin-6-yl)phenoxy]acetyl]phenyl]-2-oxoethoxy]phenyl]benzamide

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 4-(3,5-dioxo-4-azatricyclo[5.2.1.02,6]decan-4-yl)-N-[4-[2-[3-[2-[4-ethoxy-2-(6-oxobenzo[c][2,1]benzoxaphosphinin-6-yl)phenoxy]acetyl]phenyl]-2-oxoethoxy]phenyl]benzamide
• 化学式: C₅₂H₄₃N₂O₁₀P
• 分子量: 886.9
• InChiKey: WUNHQQSNWBGYIQ-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  8.5
• 重原子数：
  65
• 可旋转键数：
  14
• 环数：
  10.0
• sp3杂化的碳原子比例：
  0.21
• 拓扑面积：
  155
• 氢给体数：
  1
• 氢受体数：
  10

文献信息

• RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, INSULATING FILM, PREPREG, AND PRINTED CIRCUIT BOARD
  申请人：SAMSUNG ELECTRO-MECHANICS CO., LTD.

  公开号：US20140147639A1

  公开（公告）日：2014-05-29

  Disclosed herein are a resin composition of a printed circuit board including a liquid crystal oligomer, an epoxy resin, and a phenolic curing agent having five or more functional groups, an insulating film and a prepreg manufactured using the resin composition, and a printed circuit board including the insulating film or the prepreg. The resin composition for a printed circuit board according to the present invention, and the insulating film and the prepreg manufactured using the same, may have low coefficient of thermal expansion, excellent heat resistance property, and a high glass transition temperature.