6-(2-prop-2-enylphenoxy)-2,5-dihydro-1H-1,3,5,2,4,6-triazatriphosphinine

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 6-(2-prop-2-enylphenoxy)-2,5-dihydro-1H-1,3,5,2,4,6-triazatriphosphinine
• 化学式: C₉H₁₂N₃OP₃
• 分子量: 271.13
• InChiKey: BOIHQBFGKILBQK-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3
• 重原子数：
  16
• 可旋转键数：
  4
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.11
• 拓扑面积：
  45.6
• 氢给体数：
  2
• 氢受体数：
  4

文献信息

• HALOGEN-FREE RESIN COMPOSITION AND METHOD FOR PREPARATION OF COPPER CLAD LAMINATE WITH SAME
  申请人：Shengyi Technology Co., Ltd

  公开号：EP2752449A1

  公开（公告）日：2014-07-09

  A halogen-free resin composition and a method for preparation of copper clad laminate with the same, wherein based on total parts by weight of solid components, the halogen-free resin composition comprises a reactive allyl phenoxy cyclotriphosphazene or vinyl phenoxy cyclotriphosphazene of 5-50 parts, a thermosetting resin of 15-85 parts, a crosslinking curing agent of 1-35 parts, a crosslinking curing accelerant of 0-5 parts and a filler of 0-100 parts. In the present invention, the reactive allyl phenoxy cyclotriphosphazene or vinyl phenoxy cyclotriphosphazene having very low water absorption is introduced into the thermosetting resin, satisfying both the halogen-free and antiflaming requirements and improving the electrical properties of the system, and making it possible to prepare the halogen-free high-frequency high-speed substrate material. The resulted copper clad laminate satisfies the halogen-free requirement, and has advantages such as excellent resistance to heat and moisture, and low dielectric loss.

  一种无卤素树脂组合物及用其制备覆铜层压板的方法，其中按固体成分的总重量计算，无卤素树脂组合物包括 5-50 份的活性烯丙基苯氧基环三磷嗪或乙烯基苯氧基环三磷嗪、15-85 份的热固性树脂、1-35 份的交联固化剂、0-5 份的交联固化促进剂和 0-100 份的填料。在本发明中，在热固性树脂中引入了吸水性极低的活性烯丙基苯氧基环三膦唑或乙烯基苯氧基环三膦唑，既满足了无卤素和消焰的要求，又改善了体系的电性能，使无卤素高频高速基板材料的制备成为可能。最终得到的覆铜箔层压材料不仅满足了无卤要求，还具有优异的耐热性、耐湿性和低介电损耗等优点。
• US9139750B2
  申请人：——

  公开号：US9139750B2

  公开（公告）日：2015-09-22