4-(4-Methoxyphenyl)-4-[4-[4-(4-methoxyphenyl)sulfonylphenoxy]phenyl]pentanoic acid

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 4-(4-Methoxyphenyl)-4-[4-[4-(4-methoxyphenyl)sulfonylphenoxy]phenyl]pentanoic acid
• 英文别名: 4-(4-methoxyphenyl)-4-[4-[4-(4-methoxyphenyl)sulfonylphenoxy]phenyl]pentanoic acid
• 化学式: C₃₁H₃₀O₇S
• 分子量: 546.6
• InChiKey: VRGCUXPFXNPNAF-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  6.3
• 重原子数：
  39
• 可旋转键数：
  11
• 环数：
  4.0
• sp3杂化的碳原子比例：
  0.19
• 拓扑面积：
  108
• 氢给体数：
  1
• 氢受体数：
  7

文献信息

• INSULATING FILM FOR PRINTED CIRCUIT BOARD HAVING IMPROVED THERMAL CONDUCTIVITY, MANUFACTURING METHOD THEREOF, AND PRINTED CIRCUIT BOARD USING THE SAME
  申请人：SAMSUNG ELECTRO-MECHANICS CO., LTD.

  公开号：US20140174792A1

  公开（公告）日：2014-06-26

  This invention relates to an insulating film for a printed circuit board having improved thermal conductivity, a manufacturing method thereof and a printed circuit board using the same, wherein the insulating film includes an amphiphilic block copolymer having a vertical structure formed in a thickness direction by chemically coupling a hydrophilic compound with a hydrophobic compound.