1-[8-[2-[7-(2,5-Dioxopyrrol-1-yl)heptyl]-4-heptyl-5-octylcyclohexyl]octyl]pyrrole-2,5-dione

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 吡咯烷类
• 英文名称: 1-[8-[2-[7-(2,5-Dioxopyrrol-1-yl)heptyl]-4-heptyl-5-octylcyclohexyl]octyl]pyrrole-2,5-dione
• 英文别名: 1-[8-[2-[7-(2,5-dioxopyrrol-1-yl)heptyl]-4-heptyl-5-octylcyclohexyl]octyl]pyrrole-2,5-dione
• 化学式: C₄₄H₇₄N₂O₄
• 分子量: 695.1
• InChiKey: PFVWBJIHGMOCIR-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  15
• 重原子数：
  50
• 可旋转键数：
  30
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.82
• 拓扑面积：
  74.8
• 氢给体数：
  0
• 氢受体数：
  4

文献信息

• SEALANT COMPOSITION FOR ELECTRONIC DEVICE
  申请人：HENKEL AG & CO. KGAA

  公开号：US20140187714A1

  公开（公告）日：2014-07-03

  The present invention provides a sealant composition for electronic device, in which the curing does not proceed when heated, which does not cause the problem of use in the mounting process of electronic device. The present invention relates to a sealant composition for electronic device comprising (a) a compound having two or more (meth)acryloyl groups and (c) a nitroxide compound and/or a thiocarbonylthio compound.
• UNDERFILL SEALANT COMPOSITION
  申请人：HENKEL AG & CO. KGAA

  公开号：US20140187729A1

  公开（公告）日：2014-07-03

  The present invention provides a composition which does not cause the problem of use at high temperature in the mounting process of electronic device. The present invention relates to an underfill sealant composition comprising (a) a (meth)acrylic compound and (c) an isocyanuric acid having an allyl group.
• CURABLE RESIN COMPOSITION FOR SEALING LIQUID CRYSTAL
  申请人：Henkel AG & Co. KGaA

  公开号：US20160355734A1

  公开（公告）日：2016-12-08

  The present invention relates to a curable resin composition for sealing liquid crystal. The curable resin composition comprises a maleimide resin, an epoxy resin, a thermal free radical initiator, and a latent epoxy curing agent. More specifically, the resin composition can be cured with a combination of ultraviolet (UV) radiation and heat, resulting in a cured product with good curability in light-shielded area, excellent adhesion strength and high reliability.
• CURABLE ADHESIVE COMPOSITION FOR DIE ATTACH
  申请人：Henkel AG & Co. KGaA

  公开号：US20210062047A1

  公开（公告）日：2021-03-04

  This invention relates to a curable adhesive composition. In particular, the present invention relates to a curable adhesive composition for die attach, which eliminates the void issue, minimizes the fillet, and has lower bond line thickness and tilt trend, when cured.
• US9334429B2
  申请人：——

  公开号：US9334429B2

  公开（公告）日：2016-05-10